Inventor · disambiguated record
Masafumi Miyakawa
Also filed as: MIYAKAWA MASAFUMI
3 granted patents·2 pending applications·27 citations·filing 2002–2005
61Inventor score
Technology areasH10P
Files withMITSUI CHEMICALS INC4
Top patents by PatentIndex Score
5 records- 0179US7201969B2Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the filmMITSUI CHEMICALS INC·Filed 2003·Granted Apr 10, 2007·26 cites·4 claims
- 0258US7501312B2Method of protecting semiconductor wafer and adhesive film for protection of semiconductor waferMITSUI CHEMICALS INC·Filed 2005·Granted Mar 10, 2009·1 cites·6 claims
- 0335US7238421B2Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive filmMITSUI CHEMICALS INC·Filed 2003·Granted Jul 3, 2007·0 cites·4 claims
- 0435US2005244631A1Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the sameMITSUI CHEMICALS INC·Filed 2005·Application pending·0 cites
- 0533US2003064579A1Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive filmFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →