Inventor · disambiguated record
Norihiko Tsuchiya
Also filed as: TSUCHIYA NORIHIKO
18 granted patents·548 citations·filing 1988–2016
95Inventor score
Top patents by PatentIndex Score
18 records- 0190US6320655B1Defect-position identifying method for semiconductor substrateTOSHIBA KK·Filed 2000·Granted Nov 20, 2001·68 cites·13 claims
- 0286US5738942ASemiconductor silicon wafer and process for producing itTOSHIBA KK·Filed 1995·Granted Apr 14, 1998·73 cites·8 claims
- 0385US7057259B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themTOSHIBA KK·Filed 2002·Granted Jun 6, 2006·35 cites·38 claims
- 0484US5534294AProcess for producing Semiconductor silicon waferTOSHIBA KK·Filed 1994·Granted Jul 9, 1996·79 cites·4 claims
- 0583US5071776AWafer processsing method for manufacturing wafers having contaminant-gettering damage on one surfaceTOSHIBA KK·Filed 1988·Granted Dec 10, 1991·74 cites·14 claims
- 0678US5675176ASemiconductor device and a method for manufacturing the sameTOSHIBA KK·Filed 1995·Granted Oct 7, 1997·43 cites·21 claims
- 0777US7700381B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themKABUSHIKIA KAISHA TOSHIBA·Filed 2006·Granted Apr 20, 2010·9 cites·1 claims
- 0875US5994756ASubstrate having shallow trench isolationTOSHIBA KK·Filed 1996·Granted Nov 30, 1999·56 cites·16 claims
- 0973US10008426B2Etching method and etchantTOSHIBA MEMORY CORP·Filed 2016·Granted Jun 26, 2018·2 cites·17 claims
- 1071US5755877AMethod of growing thin film on semiconductor substrate and its manufacturing apparatusTOSHIBA KK·Filed 1996·Granted May 26, 1998·25 cites·18 claims
- 1168US6963630B2Method for evaluating an SOI substrate, evaluation processor, and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2003·Granted Nov 8, 2005·13 cites·16 claims
- 1265US7188049B2System and method for controlling manufacturing processes, and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2005·Granted Mar 6, 2007·2 cites·20 claims
- 1364US7314766B2Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatusTOSHIBA KK·Filed 2003·Granted Jan 1, 2008·9 cites·23 claims
- 1450US5739575ADielectrically isolated substrate and method for manufacturing the sameTOSHIBA KK·Filed 1996·Granted Apr 14, 1998·16 cites·13 claims
- 1549US6146911ASemiconductor wafer and method of manufacturing the sameTOSHIBA KK·Filed 1999·Granted Nov 14, 2000·14 cites·10 claims
- 1647US6919260B1Method of manufacturing a substrate having shallow trench isolationTOSHIBA KK·Filed 1999·Granted Jul 19, 2005·16 cites·34 claims
- 1747US5148457ASystem for analyzing metal impurity on the surface of a single crystal semiconductor by using total reflection of x-rays fluorescenceTOSHIBA KK·Filed 1991·Granted Sep 15, 1992·14 cites·6 claims
- 1844US7531462B2Method of inspecting semiconductor waferTOSHIBA KK·Filed 2006·Granted May 12, 2009·0 cites·14 claims
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