Inventor · disambiguated record
Howard Lee Marks
Also filed as: MARKS HOWARD · MARKS HOWARD LEE
10 granted patents·1 pending application·121 citations·filing 2003–2021
88Inventor score
Files withNVIDIA CORP11
Top patents by PatentIndex Score
11 records- 0194US8357931B2Flip chip semiconductor die internal signal access system and methodNVIDIA CORP·Filed 2007·Granted Jan 22, 2013·75 cites·20 claims
- 0274US7429528B2Method of fabricating a pad over active circuit I.C. with meshed support structureNVIDIA CORP·Filed 2005·Granted Sep 30, 2008·5 cites·11 claims
- 0372US7842948B2Flip chip semiconductor die internal signal access system and methodNVIDIA CORP·Filed 2004·Granted Nov 30, 2010·24 cites·13 claims
- 0468US7791193B2Pad over active circuit system and method with meshed support structureNVIDIA CORP·Filed 2007·Granted Sep 7, 2010·3 cites·7 claims
- 0565US7649269B2Pad over active circuit system and method with frame support structureNVIDIA CORP·Filed 2007·Granted Jan 19, 2010·2 cites·5 claims
- 0661US7453158B2Pad over active circuit system and method with meshed support structureNVIDIA CORP·Filed 2003·Granted Nov 18, 2008·8 cites·14 claims
- 0752US7495343B1Pad over active circuit system and method with frame support structureNVIDIA CORP·Filed 2003·Granted Feb 24, 2009·4 cites·16 claims
- 0848US11545450B2Interlocked redistribution layer interface for flip-chip integrated circuitsNVIDIA CORP·Filed 2020·Granted Jan 3, 2023·0 cites·29 claims
- 0947US8017520B2Method of fabricating a pad over active circuit I.C. with frame support structureNVIDIA CORP·Filed 2005·Granted Sep 13, 2011·0 cites·17 claims
- 1046US2023103147A1Low stress plane design for ic package substrateNVIDIA CORP·Filed 2021·Application pending·0 cites
- 1143US8951814B2Method of fabricating a flip chip semiconductor die with internal signal accessNVIDIA CORP·Filed 2013·Granted Feb 10, 2015·0 cites·17 claims
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