Inventor · disambiguated record
Nobuya Makino
Also filed as: MAKINO NOBUYA
3 granted patents·79 citations·filing 2005–2006
74Inventor score
Files withDENSO CORP3
Top patents by PatentIndex Score
3 records- 0193US7470996B2Packaging methodDENSO CORP·Filed 2006·Granted Dec 30, 2008·32 cites·5 claims
- 0291US7285854B2Wire bonding method and semiconductor deviceDENSO CORP·Filed 2005·Granted Oct 23, 2007·27 cites·5 claims
- 0386US7405478B2Substrate package structure and packaging method thereofDENSO CORP·Filed 2005·Granted Jul 29, 2008·20 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →