Inventor · disambiguated record
Richard D. Weale
Also filed as: WEALE RICHARD D · WEALE RICHARD DEAN
4 granted patents·71 citations·filing 1991–1994
78Inventor score
Files withIBM4
Top patents by PatentIndex Score
4 records- 0158US5288541AMethod for metallizing through holes in thin film substrates, and resulting devicesIBM·Filed 1991·Granted Feb 22, 1994·26 cites·34 claims
- 0251US5128008AMethod of forming a microelectronic package having a copper substrateIBM·Filed 1991·Granted Jul 7, 1992·22 cites·16 claims
- 0348US5525369AMethod for metallizing through holes in thin film substrates, and resulting devicesIBM·Filed 1993·Granted Jun 11, 1996·16 cites·4 claims
- 0439US6235411B1Process for coating a substrate with metallic layerIBM·Filed 1994·Granted May 22, 2001·7 cites·11 claims
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