Inventor · disambiguated record
Chia-Hsiang Hsu
Also filed as: HSU CHIA-HSIANG
63 granted patents·18 pending applications·302 citations·filing 2004–2023
98Inventor score
Files withCORETECH SYS CO LTD54MEDIATEK INC11NANYA TECHNOLOGY CORP7RALINK TECHNOLOGY CORP4HSU CHIA HSIANG2
Top patents by PatentIndex Score
81 records- 0198US11378505B1Method of measuring extensional viscosity of polymer melts and capillary injection systemCORETECH SYS CO LTD·Filed 2022·Granted Jul 5, 2022·7 cites·12 claims
- 0297US11742286B2Semiconductor device with interconnect part and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 29, 2023·4 cites·10 claims
- 0397US9573307B1Method for preparing a fiber-reinforced composite article by using computer-aided engineeringCORETECH SYS CO LTD·Filed 2016·Granted Feb 21, 2017·16 cites·8 claims
- 0497US9283695B1Computer-implemented simulation method and non-transitory computer medium capable of predicting fiber orientation for use in a molding processCORETECH SYS CO LTD·Filed 2015·Granted Mar 15, 2016·17 cites·20 claims
- 0596US11355435B2Semiconductor device with air gapsNANYA TECHNOLOGY CORP·Filed 2020·Granted Jun 7, 2022·4 cites·15 claims
- 0696US10201921B1Molding system for preparing fiber-reinforced thermoplastic composite articleCORETECH SYS CO LTD·Filed 2018·Granted Feb 12, 2019·7 cites·12 claims
- 0796USD817970SDisplay screen with an animated graphical user interfaceCORETECH SYS CO LTD·Filed 2016·Granted May 15, 2018·72 cites·1 claims
- 0895US9919465B1Molding system for preparing an injection molded fiber reinforced composite articleCORETECH SYS CO LTD·Filed 2017·Granted Mar 20, 2018·8 cites·28 claims
- 0994US9862133B1Molding system for preparing an injection molded fiber reinforced composite articleCORETECH SYS CO LTD·Filed 2017·Granted Jan 9, 2018·7 cites·6 claims
- 1093US10377066B1Molding system for preparing fiber-reinforced thermoplastic composite articleCORETECH SYS CO LTD·Filed 2018·Granted Aug 13, 2019·4 cites·8 claims
- 1193US10076862B1Molding systemCORETECH SYS CO LTD·Filed 2017·Granted Sep 18, 2018·5 cites·20 claims
- 1293US9555571B1Method for operating a molding machine with a predicted in-mold PVT waveform of a molding resinCORETECH SYS CO LTD·Filed 2015·Granted Jan 31, 2017·15 cites·22 claims
- 1392US11602908B1Method of mesh generation for resin transfer molding processCORETECH SYS CO LTD·Filed 2021·Granted Mar 14, 2023·4 cites·10 claims
- 1492US10710285B1Molding system for preparing fiber-reinforced thermoplastic composite articleCORETECH SYS CO LTD·Filed 2020·Granted Jul 14, 2020·2 cites·13 claims
- 1591US9684295B2Molding system and method for operating the sameCORETECH SYS CO LTD·Filed 2016·Granted Jun 20, 2017·8 cites·10 claims
- 1689US9894708B2Coordination of Wi-Fi P2P and LTE data trafficMEDIATEK INC·Filed 2016·Granted Feb 13, 2018·20 cites·22 claims
- 1789US9409335B1Computer-implemented simulation method and non-transitory computer medium for use in molding processCORETECH SYS CO LTD·Filed 2015·Granted Aug 9, 2016·8 cites·13 claims
- 1888US11355361B1Method of measuring underfill profile of underfill cavity having solder bumpsCORETECH SYS CO LTD·Filed 2021·Granted Jun 7, 2022·2 cites·19 claims
- 1987US11027470B1Molding system for preparing injuection-molded articleCORETECH SYS CO LTD·Filed 2020·Granted Jun 8, 2021·1 cites·10 claims
- 2087USD784392SDisplay screen with an animated graphical user interfaceCORETECH SYS CO LTD·Filed 2016·Granted Apr 18, 2017·30 cites·1 claims
- 2186US11230044B2Method of setting pressure profile of injection-molding apparatusCORETECH SYS CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·14 claims
- 2286US10703030B1Molding system for preparing fiberless thermoplastic composite articleCORETECH SYS CO LTD·Filed 2019·Granted Jul 7, 2020·2 cites·10 claims
- 2386US10427344B1Molding system for preparing an injection molded fiber reinforced composite articleCORETECH SYS CO LTD·Filed 2019·Granted Oct 1, 2019·4 cites·5 claims
- 2483US8768662B2Predicting shrinkage of injection molded products with viscoelastic characteristicCORETECH SYS CO LTD·Filed 2013·Granted Jul 1, 2014·5 cites·14 claims
- 2581US8571828B2Method and computer readable media for determining orientation of fibers in a fluidTSENG HUAN CHANG·Filed 2011·Granted Oct 29, 2013·6 cites·26 claims
- 2680US11521903B1Method of measuring voids in underfill packageCORETECH SYS CO LTD·Filed 2021·Granted Dec 6, 2022·1 cites·12 claims
- 2780US10960592B2Computer-implemented simulation method for injection-molding processCORETECH SYS CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·9 claims
- 2877USD866566SDisplay screen with a graphical user interfaceCORETECH SYS CO LTD·Filed 2017·Granted Nov 12, 2019·17 cites·1 claims
- 2974US10940623B1Molding system for preparing molding articleCORETECH SYS CO LTD·Filed 2020·Granted Mar 9, 2021·0 cites·8 claims
- 3073USD790582SDisplay screen with animated graphical user interface for a molding processCORETECH SYS CO LTD·Filed 2016·Granted Jun 27, 2017·15 cites·1 claims
- 3173US2021362388A1Measuring apparatus of bulk viscosity of molding materialCORETECH SYS CO LTD·Filed 2021·Application pending·0 cites
- 3271US11881453B2Method for preparing a semiconductor device with interconnect partNANYA TECHNOLOGY CORP·Filed 2023·Granted Jan 23, 2024·0 cites·6 claims
- 3370US9445431B2Wireless communications devices supporting WiFi and LTE communications and methods for transmission control thereofMEDIATEK INC·Filed 2014·Granted Sep 13, 2016·2 cites·18 claims
- 3470US2022072750A1Method of adjusting a dimension of a molded productCORETECH SYS CO LTD·Filed 2021·Application pending·0 cites
- 3569US2021213663A1Method for deriving bulk viscosity of molding materialCORETECH SYS CO LTD·Filed 2020·Application pending·0 cites
- 3668US11764105B2Method for preparing semiconductor device structure with multiple linersNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 19, 2023·0 cites·6 claims
- 3767US11594447B2Semiconductor device structure with multiple liners and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 28, 2023·0 cites·7 claims
- 3866US10946597B2Method for measuring a flowing property in a resin transfer molding systemCORETECH SYS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·11 claims
- 3966US10384386B2Method for setting up a molding systemCORETECH SYS CO LTD·Filed 2018·Granted Aug 20, 2019·0 cites·20 claims
- 4065US8868389B2Computer-implemented simulation method and non-transitory computer medium for use in molding process, and molding system using the sameCORETECH SYS CO LTD·Filed 2014·Granted Oct 21, 2014·2 cites·14 claims
- 4164US11230043B2Method for setting molding conditions of injection-molding equipmentCORETECH SYS CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·7 claims
- 4264US9081923B1Computer-implemented composite simulation method and non-transitory computer medium for use in molding processCORETECH SYS CO LTD·Filed 2014·Granted Jul 14, 2015·2 cites·12 claims
- 4363USD1003928SDisplay screen or portion thereof with graphical user interfaceCORETECH SYS CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·1 claims
- 4460US12235614B2Molding system for fabricating fiber reinforcement polymer composite article and molding method thereofCORETECH SYS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·17 claims
- 4560US11309313B2Semiconductor device with landing pad of conductive polymer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 4660US11225005B2System for setting molding conditions of injection-molding equipmentCORETECH SYS CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·11 claims
- 4758US10987844B1Clamping mechanism assemblyCORETECH SYS CO LTD·Filed 2020·Granted Apr 27, 2021·0 cites·20 claims
- 4857US10919202B1Molding system for preparing injection-molded articleCORETECH SYS CO LTD·Filed 2020·Granted Feb 16, 2021·0 cites·6 claims
- 4957US2024223289A1Impedance transformation circuit and radio frequency power reliability test systemREALTEK SEMICONDUCTOR CORP·Filed 2023·Application pending·0 cites
- 5056US12418088B2Signal transmitting deviceREALTEK SEMICONDUCTOR CORP·Filed 2022·Granted Sep 16, 2025·0 cites·18 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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