Inventor · disambiguated record
Roupen Leon Keusseyan
Also filed as: KEUSSEYAN ROUPEN · KEUSSEYAN ROUPEN L · KEUSSEYAN ROUPEN LEON
20 granted patents·2 pending applications·248 citations·filing 1984–2021
95Inventor score
Files withDU PONT11TRITON MICROTECHNOLOGIES5SAMTEC INC3BAILEY RICHARD KEVIN1HERAEUS DEUTSCHLAND GMBH & CO KG1
Top patents by PatentIndex Score
22 records- 0195US9374892B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted Jun 21, 2016·32 cites·7 claims
- 0295US9236274B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted Jan 12, 2016·33 cites·3 claims
- 0393US9337060B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic componentsTRITON MICROTECHNOLOGIES·Filed 2014·Granted May 10, 2016·18 cites·16 claims
- 0492US7666568B2Composition and method for providing a patterned metal layer having high conductivityDU PONT·Filed 2007·Granted Feb 23, 2010·12 cites·14 claims
- 0591US7744717B2Process for enhancing the resolution of a thermally transferred patternDU PONT·Filed 2007·Granted Jun 29, 2010·11 cites·18 claims
- 0691US7528448B2Thin film transistor comprising novel conductor and dielectric compositionsDU PONT·Filed 2006·Granted May 5, 2009·16 cites·17 claims
- 0790US7582403B2Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefromDU PONT·Filed 2006·Granted Sep 1, 2009·8 cites·10 claims
- 0888US9184064B1System and method for metallization and reinforcement of glass substratesTRITON MICROTECHNOLOGIES·Filed 2014·Granted Nov 10, 2015·14 cites·20 claims
- 0985US9184135B1System and method for metallization and reinforcement of glass substratesTRITON MICROTECHNOLOGIES·Filed 2014·Granted Nov 10, 2015·10 cites·20 claims
- 1074US7666567B2Negative imaging method for providing a patterned metal layer having high conductivityDU PONT·Filed 2007·Granted Feb 23, 2010·2 cites·8 claims
- 1174US7052824B2Process for thick film circuit patterningDU PONT·Filed 2001·Granted May 30, 2006·14 cites·4 claims
- 1273US7901596B2Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefromDU PONT·Filed 2009·Granted Mar 8, 2011·5 cites·3 claims
- 1371US8440383B2Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefromBAILEY RICHARD KEVIN·Filed 2011·Granted May 14, 2013·3 cites·11 claims
- 1471US7741013B2Process for thick film circuit patterningDU PONT·Filed 2006·Granted Jun 22, 2010·3 cites·16 claims
- 1570US5328521AKinetic solder paste compositionDU PONT·Filed 1993·Granted Jul 12, 1994·31 cites·10 claims
- 1666US2022059436A1Filling materials and methods of filling through holes of a substrateSAMTEC INC·Filed 2021·Application pending·0 cites
- 1760US5033666AProcess for brazing metallized components to ceramic substratesDU PONT·Filed 1990·Granted Jul 23, 1991·30 cites·12 claims
- 1856US11646246B2Method of fabricating a glass substrate with a plurality of viasSAMTEC INC·Filed 2017·Granted May 9, 2023·0 cites·19 claims
- 1956US11251109B2Filling materials and methods of filling through holes of a substrateSAMTEC INC·Filed 2017·Granted Feb 15, 2022·0 cites·22 claims
- 2053US2010104829A1Process for thick film circuit patterningDU PONT·Filed 2009·Application pending·0 cites
- 2144US10403769B2Electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodesHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2013·Granted Sep 3, 2019·0 cites·21 claims
- 2242US4558590AMethod for measuring the real contact area in connectorsIBM·Filed 1984·Granted Dec 17, 1985·6 cites·14 claims
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