Inventor · disambiguated record
Myra Mcdonnell
Also filed as: MCDONNELL MYRA
5 granted patents·13 citations·filing 2018–2019
72Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0185US11056356B1Fluid viscosity control during wafer bondingINTEL CORP·Filed 2018·Granted Jul 6, 2021·5 cites·9 claims
- 0282US11329162B2Integrated circuit structures having differentiated neighboring partitioned source or drain contact structuresINTEL CORP·Filed 2018·Granted May 10, 2022·3 cites·25 claims
- 0380US10720345B1Wafer to wafer bonding with low wafer distortionINTEL CORP·Filed 2018·Granted Jul 21, 2020·3 cites·13 claims
- 0476US11721554B2Stress compensation for wafer to wafer bondingINTEL CORP·Filed 2019·Granted Aug 8, 2023·2 cites·16 claims
- 0544US10707186B1Compliant layer for wafer to wafer bondingINTEL CORP·Filed 2018·Granted Jul 7, 2020·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →