Inventor · disambiguated record
Paik Wen Ong
Also filed as: ONG PAIK WEN
4 granted patents·1 pending application·13 citations·filing 2017–2019
68Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0193US10651127B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted May 12, 2020·10 cites·7 claims
- 0278US10950552B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 0358US10636749B2Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling sameINTEL CORP·Filed 2018·Granted Apr 28, 2020·1 cites·18 claims
- 0441US10971444B2Voltage noise reduction of power delivery networks for integrated circuitsINTEL CORP·Filed 2017·Granted Apr 6, 2021·0 cites·25 claims
- 0538US2018226357A1Embedded voltage reference plane for system-in-package applicationsINTEL CORP·Filed 2018·Application pending·0 cites
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