Inventor · disambiguated record
Jeenhuei Tsai
Also filed as: TSAI JEENHUEI S
6 granted patents·3 pending applications·99 citations·filing 2001–2006
81Inventor score
Top patents by PatentIndex Score
9 records- 0194US6807731B2Method for forming an electronic assemblyDELPHI TECH INC·Filed 2002·Granted Oct 26, 2004·65 cites·14 claims
- 0273US6693239B2Overmolded circuit board with underfilled surface-mount component and method thereforDELPHI TECH INC·Filed 2001·Granted Feb 17, 2004·21 cites·34 claims
- 0364US7268429B2Technique for manufacturing an overmolded electronic assemblyDELPHI TECH INC·Filed 2005·Granted Sep 11, 2007·3 cites·20 claims
- 0454US7352070B2Polymer encapsulated electrical devicesDELPHI TECH INC·Filed 2003·Granted Apr 1, 2008·8 cites·11 claims
- 0546US2007007668A1Microelectronic assembly with underchip optical window, and method for forming sameDELPHI TECH INC·Filed 2006·Application pending·0 cites
- 0645US7553680B2Methods to provide and expose a diagnostic connector on overmolded electronic packagesDELPHI TECH INC·Filed 2004·Granted Jun 30, 2009·2 cites·4 claims
- 0742US2005081377A1Method for forming an electronic assemblyDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 0839US7202571B2Electronic module with form in-place pedestalDELPHI TECH INC·Filed 2004·Granted Apr 10, 2007·0 cites·15 claims
- 0938US2005224967A1Microelectronic assembly with underchip optical window, and method for forming sameBRANDENBURG SCOTT D·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →