Inventor · disambiguated record
Yung-Hsing Chang
Also filed as: CHANG YUNG-HSING
5 granted patents·3 pending applications·6 citations·filing 2014–2025
68Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG8
Top patents by PatentIndex Score
8 records- 0180US9978715B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted May 22, 2018·5 cites·16 claims
- 0276US2025253289A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0375US12283569B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Apr 22, 2025·0 cites·14 claims
- 0468US10229894B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 12, 2019·1 cites·20 claims
- 0554US11587903B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 21, 2023·0 cites·13 claims
- 0650US2025105188A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0745US11524890B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 13, 2022·0 cites·20 claims
- 0838US2019295914A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →