Inventor · disambiguated record
Vincent R. Landi
Also filed as: LANDI VINCENT R · LANDI VINCENT RUSSELL
18 granted patents·7 pending applications·584 citations·filing 1974–2006
96Inventor score
Top patents by PatentIndex Score
25 records- 0194US5571609APolybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereofROGERS CORP·Filed 1994·Granted Nov 5, 1996·93 cites·43 claims
- 0288US4647125ASolderless connector techniqueROGERS CORP·Filed 1985·Granted Mar 3, 1987·79 cites·13 claims
- 0387US5223568AProcess for forming hard shaped molded article of a cross-linked liquid polybutadiene or polyisoprene resin and a butadiene or isoprene containing solid polymer and resulting articlesROGERS CORP·Filed 1989·Granted Jun 29, 1993·58 cites·32 claims
- 0486US6291374B1Polybutadiene and polyisoprene based thermosetting compositions and method of manufactureWORLD PROPERTIES INC·Filed 2000·Granted Sep 18, 2001·37 cites·35 claims
- 0583US6415104B1Heating elements comprising polybutadiene and polyisoprene based thermosetting compositionsWORLD PROPERTIES INC·Filed 2000·Granted Jul 2, 2002·49 cites·77 claims
- 0683US4944087AMethod of making a curved plastic body with circuit patternROGERS CORP·Filed 1988·Granted Jul 31, 1990·46 cites·17 claims
- 0782US7022404B2Circuit substrate material, circuits comprising the same, and method of manufacture thereofWORLD PROPERTIES INC·Filed 2003·Granted Apr 4, 2006·22 cites·23 claims
- 0881US4610495ASolderless connector apparatus and method of making the sameROGERS CORP·Filed 1985·Granted Sep 9, 1986·42 cites·36 claims
- 0979US6811917B2Thermosetting composition for electrochemical cell components and methods of making thereofWORLD PROPERTIES INC·Filed 2001·Granted Nov 2, 2004·21 cites·113 claims
- 1077US7572515B2Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereofWORLD PROPERTIES INC·Filed 2005·Granted Aug 11, 2009·8 cites·26 claims
- 1177US6048807APolybutadiene and polyisoprene based thermosetting compositions and method of manufactureWORLD PROPERTIES INC·Filed 1998·Granted Apr 11, 2000·29 cites·23 claims
- 1275US5972811APolybutadiene and polyisoprene thermosetting compositions and method of manufacture thereofWORLD PROPERTIES INC·Filed 1998·Granted Oct 26, 1999·30 cites·42 claims
- 1374US3932370APowdered rubberUNIROYAL INC·Filed 1974·Granted Jan 13, 1976·16 cites·17 claims
- 1467US3956247AHalogenation of EPDM in solution in the presence of epoxide and, optionally, poly(alkylene ether) glycolUNIROYAL INC·Filed 1975·Granted May 11, 1976·16 cites·32 claims
- 1563US6586533B1Method of manufacture of polybutadiene and polyisoprene based thermosetting compositionsWORLD PROPERTIES INC·Filed 1994·Granted Jul 1, 2003·19 cites·81 claims
- 1654US4725650AHeat stable phenolic composition containing aramid fibersROGERS CORP·Filed 1986·Granted Feb 16, 1988·12 cites·24 claims
- 1745US2006246294A1Circuit materials, circuits, and methods of manufacture thereofLANDI VINCENT R·Filed 2006·Application pending·0 cites
- 1844US2006141132A1Circuit substrate material, circuits comprising the same, and method of manufacture thereofSETHUMADHAVAN MURALI·Filed 2006·Application pending·0 cites
- 1940US4659758AHeat stable phenolic compositionROGERS CORP·Filed 1986·Granted Apr 21, 1987·6 cites·24 claims
- 2039US2002155333A1Apparatus and method for electrochemical cell componentsFiled 2002·Application pending·0 cites
- 2138US2003075270A1Method for improving bonding of circuit substrates to metal and articles formed therebyFiled 2002·Application pending·0 cites
- 2238US2005208278A1Method for improving bonding of circuit substrates to metal and articles formed therebyLANDI VINCENT R·Filed 2005·Application pending·0 cites
- 2336US2003113523A1Silanated copper foils, method of making, and use thereofFiled 2002·Application pending·0 cites
- 2431US4357269AMolding compoundROGERS CORP·Filed 1981·Granted Nov 2, 1982·1 cites·7 claims
- 2529US2001009930A1Elastomeric shock absorbing component and method of manufacture thereofFiled 1999·Application pending·0 cites
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