Inventor · disambiguated record
Ying-Hsien Chen
Also filed as: CHEN YING · CHEN YING-HSIEN
6 granted patents·6 pending applications·20 citations·filing 2006–2024
75Inventor score
Files withIND TECH RES INST3UNITED MICROELECTRONICS CORP3AU OPTRONICS CORP2SIGNIFY HOLDING BV2HUANG YU HUNG1
Top patents by PatentIndex Score
12 records- 0190US10249729B1Method for fabricating metal replacement gate semiconductor device using dummy gate and composite spacer structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 2, 2019·7 cites·7 claims
- 0285US10038022B1Light detectorAU OPTRONICS CORP·Filed 2017·Granted Jul 31, 2018·9 cites·19 claims
- 0369USD1032908SDownlightSIGNIFY HOLDING BV·Filed 2022·Granted Jun 25, 2024·4 cites·1 claims
- 0456US12044381B2Light fixture with lightguide trimSIGNIFY HOLDING BV·Filed 2021·Granted Jul 23, 2024·0 cites·14 claims
- 0554US7704116B2Methods for fabricating field emission display devicesIND TECH RES INST·Filed 2007·Granted Apr 27, 2010·0 cites·20 claims
- 0654US2024379670A1Semiconductor device and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0753US2007159059A1Anode plate for a field emission display deviceIND TECH RES INST·Filed 2007·Application pending·0 cites
- 0853US2025019129A1Sealing structureLITE ON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0950US7632166B2Method for improving vacuumIND TECH RES INST·Filed 2006·Granted Dec 15, 2009·0 cites·16 claims
- 1050US2024363430A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1131US2019378812A1Device for producing semico nductor bump metal layerHUANG YU HUNG·Filed 2018·Application pending·0 cites
- 1229US2016365465A1Sensor and manufacturing method of sensorAU OPTRONICS CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →