Inventor · disambiguated record
Zi Qun Hua
Also filed as: HUA ZI QUN
16 granted patents·1 pending application·30 citations·filing 2018–2024
90Inventor score
Files withYANGTZE MEMORY TECH CO LTD17
Top patents by PatentIndex Score
17 records- 0190US10748851B1Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 18, 2020·6 cites·20 claims
- 0289US11462503B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 0388US11205619B2Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·9 claims
- 0487US10840125B2Memory structure and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Nov 17, 2020·6 cites·18 claims
- 0586US10784225B2Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Sep 22, 2020·4 cites·16 claims
- 0683US10497708B1Memory structure and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 3, 2019·4 cites·20 claims
- 0782US11049834B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
- 0882US10727056B2Method and structure for cutting dense line patterns using self-aligned double patterningYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jul 28, 2020·3 cites·8 claims
- 0982US2024332167A1Self-aligned contacts in three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1078US12074105B2Self-aligned contacts in three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 1172US11664309B2Self-aligned contacts in three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted May 30, 2023·0 cites·15 claims
- 1268US12347684B2Method and structure for cutting dense line patterns using self-aligned double patterningYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1364US11430756B2Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 1463US11552012B2Self-aligned contacts in three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jan 10, 2023·0 cites·13 claims
- 1560US11710730B2Fabricating method of semiconductor device with exposed input/output pad in recessYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·8 claims
- 1660US11251043B2Method and structure for cutting dense line patterns using self-aligned double patterningYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1753US11430775B2Semiconductor device with exposed input/output pad in recessYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 30, 2022·0 cites·11 claims
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