Inventor · disambiguated record
Nobuyoshi Kimoto
Also filed as: KIMOTO NOBUYOSHI
11 granted patents·3 pending applications·131 citations·filing 2000–2021
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0188US6762937B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 13, 2004·41 cites·2 claims
- 0286US10104775B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 16, 2018·9 cites·13 claims
- 0384US6522544B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·31 cites·5 claims
- 0481US6900986B2Power moduleRYODEN SEMICONDUCTOR SYST ENG·Filed 2004·Granted May 31, 2005·25 cites·4 claims
- 0579US12334408B2Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jun 17, 2025·1 cites·7 claims
- 0674US6563211B2Semiconductor device for controlling electricityMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 13, 2003·24 cites·5 claims
- 0754US12347741B2Semiconductor device comprising a resin member having a rib including a lower end located below lower ends of a plurality of pin fins and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jul 1, 2025·0 cites·18 claims
- 0848US2024234237A1Power semiconductor device and method for manufacturing power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0947US2024096744A1Semiconductor device and inverter unitMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1046US10950558B2Semiconductor device, power converter, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 16, 2021·0 cites·15 claims
- 1145US11621213B2Semiconductor device including a spring plateMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 4, 2023·0 cites·21 claims
- 1243US11302655B2Semiconductor device including a semiconductor element and a lead frame with a plurality of holesMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 12, 2022·0 cites·10 claims
- 1339US12119314B2Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Oct 15, 2024·0 cites·16 claims
- 1434US2002060356A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
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