Inventor · disambiguated record
Junho Ye
Also filed as: YE JUNHO
6 granted patents·2 citations·filing 2020–2023
70Inventor score
Technology areasH10W
Files withSTATS CHIPPAC PTE LTD6
Top patents by PatentIndex Score
6 records- 0191US11887863B2Double-sided partial molded SIP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jan 30, 2024·2 cites·19 claims
- 0278US12211803B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·22 claims
- 0376US12374559B2Double-sided partial molded SiP moduleSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jul 29, 2025·0 cites·18 claims
- 0475US12211808B2Semiconductor device and method of forming discrete antenna modulesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·25 claims
- 0568US11894314B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 6, 2024·0 cites·25 claims
- 0665US11735539B2Semiconductor device and method of forming discrete antenna modulesSTATS CHIPPAC PTE LTD·Filed 2020·Granted Aug 22, 2023·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →