Inventor · disambiguated record
Mengyong Liu
Also filed as: LIU MENGYONG
4 granted patents·2 pending applications·5 citations·filing 2018–2024
62Inventor score
Files withYANGTZE MEMORY TECH CO LTD6
Top patents by PatentIndex Score
6 records- 0182US10790260B2Plasma activation treatment for wafer bondingYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Sep 29, 2020·4 cites·20 claims
- 0270US12451460B2Wafer bonding apparatus and methodYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·18 claims
- 0369US11257706B2Semiconductor device flipping apparatusYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 22, 2022·1 cites·16 claims
- 0462US11955454B2Wafer bonding apparatus and methodYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 0552US2023135060A1Method and apparatus for wafer bondingYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 0648US2024170295A1Semiconductor structure bonding method, bonding equipment, memory, memory systemYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →