Inventor · disambiguated record
Shih-Jang Lin
Also filed as: LIN SHIH-JANG
4 granted patents·291 citations·filing 2000–2003
83Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
4 records- 0196US6426281B1Method to form bump in bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·147 cites·17 claims
- 0293US6586323B1Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 1, 2003·76 cites·13 claims
- 0386US6958546B2Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 25, 2005·45 cites·9 claims
- 0478US6936923B2Method to form very a fine pitch solder bump using methods of electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 30, 2005·23 cites·9 claims
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