Inventor · disambiguated record
Pin-Yi Hsin
Also filed as: HSIN PIN-YI
10 granted patents·2 pending applications·160 citations·filing 2000–2024
87Inventor score
Top patents by PatentIndex Score
12 records- 0192US6569777B1Plasma etching method to form dual damascene with improved via profileTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 27, 2003·105 cites·20 claims
- 0277US7015089B2Method to improve etching of resist protective oxide (RPO) to prevent photo-resist peelingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 21, 2006·23 cites·7 claims
- 0374US6498106B1Prevention of defects formed in photoresist during wet etchingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 24, 2002·19 cites·14 claims
- 0465US6444587B1Plasma etch method incorporating inert gas purgeTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Sep 3, 2002·10 cites·8 claims
- 0563US2024387215A1Semiconductor apparatus and method of collecting residuesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0661US10665489B2Integrated chip die carrier exchangerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·0 cites·20 claims
- 0759US11545382B2Integrated chip die carrier exchangerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 0858US12217989B2Semiconductor apparatus and method of collecting residuesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 0946US6833233B2Deep UV-resistant photoresist plug for via holeTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 21, 2004·3 cites·8 claims
- 1039US10861761B2Semiconductor packaged wafer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 1134US7001784B2Method to control spacer widthTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 21, 2006·0 cites·39 claims
- 1229US2005136664A1Novel process for improved hot carrier injectionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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