Inventor · disambiguated record
Mitchell M. Hamamoto
Also filed as: HAMAMOTO MITCHELL M
3 granted patents·8 citations·filing 2006–2010
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0166US7781870B2Wire bond and redistribution layer processMICRO DEVICES CORP CALIFORNIA·Filed 2009·Granted Aug 24, 2010·3 cites·12 claims
- 0260US7541251B2Wire bond and redistribution layer processMICRO DEVICES CORP CALIFORNIA·Filed 2006·Granted Jun 2, 2009·3 cites·11 claims
- 0356US8058712B2Device having wire bond and redistribution layerHAMAMOTO MITCHELL M·Filed 2010·Granted Nov 15, 2011·2 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →