Inventor · disambiguated record
Satoshi Ookawa
Also filed as: OOKAWA SATOSHI
5 granted patents·2 pending applications·2 citations·filing 2014–2025
62Inventor score
Files withTOKYO ELECTRON LTD7
Top patents by PatentIndex Score
7 records- 0165US9469093B2Bonding apparatus, bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2014·Granted Oct 18, 2016·2 cites·9 claims
- 0265US2025191905A1Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0353US12255063B2Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 18, 2025·0 cites·25 claims
- 0444US9165803B2Bonding method, bonding apparatus and bonding systemTOKYO ELECTRON LTD·Filed 2014·Granted Oct 20, 2015·0 cites·13 claims
- 0541US9005385B2Bonding apparatus, bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2014·Granted Apr 14, 2015·0 cites·9 claims
- 0638US9486989B2Bonding method, bonding apparatus, and bonding systemTOKYO ELECTRON LTD·Filed 2014·Granted Nov 8, 2016·0 cites·8 claims
- 0736US2021280429A1Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →