Inventor · disambiguated record
Jonathan G. Weis
Also filed as: WEIS JONATHAN G · WEIS JONATHAN GARRETT
7 granted patents·6 pending applications·16 citations·filing 2013–2024
77Inventor score
Files withPPG IND OHIO INC8ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC4MASSACHUSETTS INST TECHNOLOGY1
Top patents by PatentIndex Score
13 records- 0195US10391606B2Chemical mechanical polishing pads for improved removal rate and planarizationROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2017·Granted Aug 27, 2019·10 cites·10 claims
- 0282US2025059386A1Electrodepositable coating composition including a phyllosilicate pigment and a dispersing agentPPG IND OHIO INC·Filed 2024·Application pending·0 cites
- 0375US12084349B2Dispersions containing graphenic carbon nanoparticles and dispersant resinsPPG IND OHIO INC·Filed 2020·Granted Sep 10, 2024·1 cites·10 claims
- 0474US9459222B2Methods for deposition of materials including mechanical abrasionMASSACHUSETTS INST TECHNOLOGY·Filed 2013·Granted Oct 4, 2016·4 cites·30 claims
- 0574US2024425375A1Dispersions containing graphenic carbon nanoparticles and dispersant resinsPPG IND OHIO INC·Filed 2024·Application pending·0 cites
- 0673US12157832B2Electrodepositable coating composition including a phyllosilicate pigment and a dispersing agentPPG IND OHIO INC·Filed 2020·Granted Dec 3, 2024·0 cites·22 claims
- 0770US10086494B2High planarization efficiency chemical mechanical polishing pads and methods of makingROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted Oct 2, 2018·1 cites·10 claims
- 0869US12173178B2Polyfunctional hydrazide crosslinkerPPG IND OHIO INC·Filed 2021·Granted Dec 24, 2024·0 cites·22 claims
- 0969US2023294240A1Chemical mechanical polishing pads for improved removal rate and planarizationROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2023·Application pending·0 cites
- 1066US2025122150A1Carbazate-functional compoundPPG IND OHIO INC·Filed 2022·Application pending·0 cites
- 1163US2024034827A1Aqueous dispersion comprising alpha effect based nucleophilePPG IND OHIO INC·Filed 2021·Application pending·0 cites
- 1255US12195582B2Conductive polymer compositionPPG IND OHIO INC·Filed 2019·Granted Jan 14, 2025·0 cites·23 claims
- 1351US2018345449A1Chemical mechanical polishing pads for improved removal rate and planarizationROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2018·Application pending·0 cites
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