Inventor · disambiguated record
Gordon C. Osborne, Jr.
Also filed as: OSBORNE JR GORDON C · OSBORNE JR GORDON CHARLES
7 granted patents·219 citations·filing 1988–2012
87Inventor score
Top patents by PatentIndex Score
7 records- 0187US5523696AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1993·Granted Jun 4, 1996·64 cites·7 claims
- 0286US5528159AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1995·Granted Jun 18, 1996·63 cites·10 claims
- 0371US4907734AMethod of bonding gold or gold alloy wire to lead tin solderIBM·Filed 1988·Granted Mar 13, 1990·42 cites·12 claims
- 0468US5672980AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1996·Granted Sep 30, 1997·26 cites·2 claims
- 0564US9040390B2Releasable buried layer for 3-D fabrication and methods of manufacturingDAUBENSPECK TIMOTHY H·Filed 2012·Granted May 26, 2015·1 cites·18 claims
- 0664US6603195B1Planarized plastic package modules for integrated circuitsIBM·Filed 2000·Granted Aug 5, 2003·15 cites·16 claims
- 0741US5659256AMethod and apparatus for testing integrated circuit chipsIBM·Filed 1996·Granted Aug 19, 1997·8 cites·3 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →