Inventor · disambiguated record
Hideaki Hori
Also filed as: HORI HIDEAKI
9 granted patents·5 pending applications·30 citations·filing 2003–2020
82Inventor score
Top patents by PatentIndex Score
14 records- 0178US7323252B2Biaxially oriented multilayer polypropylene filmSUMITOMO CHEMICAL CO·Filed 2005·Granted Jan 29, 2008·4 cites·1 claims
- 0272US6822049B2Propylene-based resin composition and film made of the sameSUMITOMO CHEMICAL CO·Filed 2003·Granted Nov 23, 2004·11 cites·14 claims
- 0371US7563847B2Polymer composition and film thereofSUMITOMO CHEMICAL CO·Filed 2007·Granted Jul 21, 2009·1 cites·6 claims
- 0466US7276558B2Polymer composition and film thereofSUMITOMO CHEMICAL CO·Filed 2004·Granted Oct 2, 2007·6 cites·5 claims
- 0559US6818703B2Propylene-based resin composition and film made of the sameSUMITOMO CHEMICAL CO·Filed 2003·Granted Nov 16, 2004·8 cites·5 claims
- 0651US12168891B2Mechanical key and card keyTOKAI RIKA CO LTD·Filed 2020·Granted Dec 17, 2024·0 cites·5 claims
- 0751US2009048404A1Polypropylene resin composition and oriented film thereofSUMITOMO CHEMICAL CO·Filed 2008·Application pending·0 cites
- 0850US2007238834A1Polypropylene compositionSUMITOMO CHEMICAL CO·Filed 2007·Application pending·0 cites
- 0946US2009313630A1Computer program, apparatus, and method for software modification managementFUJITSU LTD·Filed 2009·Application pending·0 cites
- 1046US2005187367A1Biaxially oriented polypropylene filmSUMITOMO CHEMICAL CO·Filed 2005·Application pending·0 cites
- 1144US2009292077A1Polypropylene-based resin composition and filmSUMITOMO CHEMICAL CO·Filed 2009·Application pending·0 cites
- 1243US7273907B2Polypropylene resin composition and filmSUMITOMO CHEMICAL CO·Filed 2003·Granted Sep 25, 2007·0 cites·6 claims
- 1340US9127133B2Polypropylene-based resin composition and filmMIYAGUCHI YUKITO·Filed 2009·Granted Sep 8, 2015·0 cites·4 claims
- 1433US7890271B2Revolution indicator and a program for the revolution indicatorONO SOKKI CO LTD·Filed 2007·Granted Feb 15, 2011·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →