Inventor · disambiguated record
Hidekazu Okabayashi
Also filed as: OKABAYASHI HIDEKAZU
6 granted patents·202 citations·filing 1980–2000
86Inventor score
Top patents by PatentIndex Score
6 records- 0183US4558507AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1983·Granted Dec 17, 1985·63 cites·11 claims
- 0283US4551908AProcess of forming electrodes and interconnections on silicon semiconductor devicesNIPPON ELECTRIC CO·Filed 1984·Granted Nov 12, 1985·41 cites·7 claims
- 0374US4348746ASemiconductor integrated circuit device having a plurality of insulated gate field effect transistorsNIPPON ELECTRIC CO·Filed 1980·Granted Sep 7, 1982·32 cites·16 claims
- 0471US6670639B1Copper interconnectionNEC CORP·Filed 2000·Granted Dec 30, 2003·18 cites·5 claims
- 0561US5545591AMethod for forming an aluminum film used as an interconnect in a semiconductor deviceNEC CORP·Filed 1995·Granted Aug 13, 1996·28 cites·7 claims
- 0650US5308792AMethod for fabricating semiconductor deviceNEC CORP·Filed 1992·Granted May 3, 1994·20 cites·21 claims
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