Inventor · disambiguated record
Michel Hendrikus Lambertus Teunissen
Also filed as: TEUNISSEN MICHEL HENDRIKUS L · TEUNISSEN MICHEL HENDRIKUS LAMBERTUS
3 granted patents·1 pending application·1 citations·filing 2004–2018
50Inventor score
Top patents by PatentIndex Score
4 records- 0149US10720340B2Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic componentsBESI NETHERLANDS BV·Filed 2018·Granted Jul 21, 2020·0 cites·10 claims
- 0244US10032653B2Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic componentsBESI NETHERLANDS BV·Filed 2014·Granted Jul 24, 2018·0 cites·8 claims
- 0344US7608486B2Device and method for encapsulating with encapsulating material and electronic component fixed on a carrierFICO BV·Filed 2004·Granted Oct 27, 2009·1 cites·11 claims
- 0432US2006255504A1Method and casting mold for producing a protective layer on integrated componentsKROEHNERT STEFFEN·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →