Inventor · disambiguated record
Ryohta Sasaki
Also filed as: SASAKI RYOHTA
4 granted patents·2 pending applications·2 citations·filing 2017–2022
57Inventor score
Top patents by PatentIndex Score
6 records- 0184US11446845B2Method for manufacturing FRP precursor and method for manufacturing FRPHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 20, 2022·2 cites·4 claims
- 0257US2024247120A1Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0350US11497117B2Metal-clad laminate, printed wiring board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 8, 2022·0 cites·21 claims
- 0444US2019037691A1Frp precursor, laminated plate, metal-clad laminate, printed circuit board, semiconductor package, and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0540US10856423B2Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 1, 2020·0 cites·11 claims
- 0636US11040517B2Printed wiring board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jun 22, 2021·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →