Inventor · disambiguated record
Dingwei Xia
Also filed as: XIA DINGWEI
2 granted patents·1 pending application·0 citations·filing 2002–2014
28Inventor score
Top patents by PatentIndex Score
3 records- 0134US8791583B2Apparatus for molding a semiconductor wafer and process thereforCHEW HWEE SENG JIMMY·Filed 2002·Granted Jul 29, 2014·0 cites·26 claims
- 0232US9524885B2Apparatus for molding a semiconductor wafer and process thereforADVANCED SYSTEMS AUTOMATION LTD·Filed 2014·Granted Dec 20, 2016·0 cites·16 claims
- 0323US2005106784A1Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor packageFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →