Inventor · disambiguated record
Kenji Sakimae
Also filed as: SAKIMAE KENJI
2 granted patents·19 citations·filing 1999–2003
60Inventor score
Technology areasH10W
Files withTOKYO TUNGSTEN KK2
Top patents by PatentIndex Score
2 records- 0155US6926861B2Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 2003·Granted Aug 9, 2005·6 cites·7 claims
- 0247US6693353B1Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 1999·Granted Feb 17, 2004·13 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →