Inventor · disambiguated record
Hidetoshi Maesato
Also filed as: MAESATO HIDETOSHI
5 granted patents·1 pending application·80 citations·filing 1998–2006
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0173US6475429B2Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Nov 5, 2002·19 cites·19 claims
- 0268US6271585B1Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 1998·Granted Aug 7, 2001·32 cites·27 claims
- 0358US7083759B2Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2001·Granted Aug 1, 2006·10 cites·7 claims
- 0455US6926861B2Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 2003·Granted Aug 9, 2005·6 cites·7 claims
- 0547US6693353B1Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 1999·Granted Feb 17, 2004·13 cites·6 claims
- 0639US2006246314A1Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2006·Application pending·0 cites
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