Inventor · disambiguated record
Bryan Duffey
Also filed as: DUFFEY BRYAN · DUFFEY BRYAN P · DUFFEY BRYAN PATRICK
7 granted patents·4 pending applications·123 citations·filing 2002–2007
87Inventor score
Files withGEN ELECTRIC6SABIC INNOVATIVE PLASTICS IP1VALLANCE MICHAEL A1VALLANCE MICHAEL ALAN1YEAGER GARY W1
Top patents by PatentIndex Score
11 records- 0191US6878782B2Thermoset composition, method, and articleGEN ELECTRIC·Filed 2002·Granted Apr 12, 2005·40 cites·58 claims
- 0290US7329708B2Functionalized poly(arylene ether) composition and methodGEN ELECTRIC·Filed 2004·Granted Feb 12, 2008·32 cites·37 claims
- 0385US7119136B2Flame-retardant thermoset composition, method, and articleGEN ELECTRIC·Filed 2004·Granted Oct 10, 2006·18 cites·46 claims
- 0484US7781537B2Functionalized poly(arylene ether) composition and methodSABIC INNOVATIVE PLASTICS IP·Filed 2007·Granted Aug 24, 2010·5 cites·22 claims
- 0578US7101923B2Flame-retardant thermoset composition, method, and articleGEN ELECTRIC·Filed 2003·Granted Sep 5, 2006·13 cites·47 claims
- 0673US7211639B2Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefromGEN ELECTRIC·Filed 2003·Granted May 1, 2007·11 cites·28 claims
- 0771US7297370B2Curable encapsulant composition, device including same, and associated methodGEN ELECTRIC·Filed 2005·Granted Nov 20, 2007·4 cites·2 claims
- 0848US2009017195A1Curable encapsulant composition and associated methodVALLANCE MICHAEL ALAN·Filed 2007·Application pending·0 cites
- 0941US2006135704A1Tack free compositions useful for electronic encapsulationVALLANCE MICHAEL A·Filed 2004·Application pending·0 cites
- 1038US2003215588A1Thermoset composition, method, and articleFiled 2002·Application pending·0 cites
- 1135US2006038324A1Molding method for curable poly(arylene ether) composition and article therebyYEAGER GARY W·Filed 2004·Application pending·0 cites
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