Inventor · disambiguated record
Hiromasa Hayashi
Also filed as: HAYASHI HIROMASA
24 granted patents·4 pending applications·123 citations·filing 1981–2020
94Inventor score
Top patents by PatentIndex Score
28 records- 0189US8649159B2Semiconductor module device and driving apparatus having the sameFUJITA TOSHIHIRO·Filed 2011·Granted Feb 11, 2014·13 cites·11 claims
- 0287US6398884B1Methods of producing steel plate, hot-dip steel plate and alloyed hot-dip steel plateKAWASAKI STEEL CO·Filed 2000·Granted Jun 4, 2002·21 cites·9 claims
- 0383US8471417B2Semiconductor module device and driving apparatus having the sameFUJITA TOSHIHIRO·Filed 2011·Granted Jun 25, 2013·8 cites·16 claims
- 0477US9123711B2Wiring member and semiconductor module having the sameDENSO CORP·Filed 2013·Granted Sep 1, 2015·4 cites·9 claims
- 0575US6648564B2Burr removing method and apparatusNIPPON KOKAN KK·Filed 2003·Granted Nov 18, 2003·12 cites·3 claims
- 0674US6954141B2Apparatus and method for tire monitoring systemDENSO CORP·Filed 2005·Granted Oct 11, 2005·4 cites·8 claims
- 0773US6897769B2Tire pressure monitoring system and method for registering identification code in the sameDENSO CORP·Filed 2003·Granted May 24, 2005·12 cites·10 claims
- 0864US6296428B1Burr removing method and apparatusNIPPON KOKAN KK·Filed 2000·Granted Oct 2, 2001·7 cites·2 claims
- 0962US8415027B2Laser welding structureHAYASHI HIROMASA·Filed 2009·Granted Apr 9, 2013·4 cites·5 claims
- 1062US7308344B2Tire rotation assisting apparatusDENSO CORP·Filed 2005·Granted Dec 11, 2007·1 cites·5 claims
- 1162US7168306B2Tire air pressure detection systemDENSO CORP·Filed 2004·Granted Jan 30, 2007·7 cites·2 claims
- 1260US9006883B2Semiconductor module with switching elementsDENSO CORP·Filed 2013·Granted Apr 14, 2015·1 cites·12 claims
- 1359US9579739B2Manufacturing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 28, 2017·1 cites·4 claims
- 1456US8637777B2Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrateHAYASHI HIROMASA·Filed 2009·Granted Jan 28, 2014·1 cites·12 claims
- 1550US6402441B2Burr removing method and apparatusNIPPON KOKAN KK·Filed 2001·Granted Jun 11, 2002·2 cites·3 claims
- 1646US9112018B2Insulating substrate, method of manufacturing the same, and semiconductor deviceHAYASHI HIROMASA·Filed 2014·Granted Aug 18, 2015·0 cites·14 claims
- 1746US2007183966A1Waste heat recovery apparatus, waste heat recovery system, and method of recovering waste heatJFE HOLDINGS INC·Filed 2005·Application pending·0 cites
- 1843US10391573B2Method of cutting and removing adhesive matter at end of cuboid metal material and removal apparatusJFE STEEL CORP·Filed 2014·Granted Aug 27, 2019·0 cites·8 claims
- 1943US2019146007A1Shunt resistor and method of mounting the sameDENSO CORP·Filed 2019·Application pending·0 cites
- 2041US9922906B2Electronic device and manufacturing method of electronic deviceDENSO CORP·Filed 2014·Granted Mar 20, 2018·0 cites·18 claims
- 2140US2002061237A1Burr removing method and apparatusNKK CORP A CORP OF JAPAN·Filed 2001·Application pending·0 cites
- 2239US10998295B2Semiconductor deviceDENSO CORP·Filed 2019·Granted May 4, 2021·0 cites·7 claims
- 2338US11890937B2Vehicle drive transmission device and vehicle drive device including sameAISIN FUKUI CORP·Filed 2020·Granted Feb 6, 2024·0 cites·12 claims
- 2438US4459837AMethod of indirect extrusion of metalSUMITO LIGHT METAL IND LTD·Filed 1981·Granted Jul 17, 1984·11 cites·8 claims
- 2537US2015027589A1Solder PasteSENJU METAL INDUSTRY CO·Filed 2012·Application pending·0 cites
- 2634US5289426ADual port memory having address conversion functionTOSHIBA KK·Filed 1991·Granted Feb 22, 1994·5 cites·14 claims
- 2733US7448244B2Process for producing hot-rolled steel strip and apparatus thereforJFE STEEL CORP·Filed 2003·Granted Nov 11, 2008·0 cites·32 claims
- 2833US4646132AIC socket having a backup power cell and circuitTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Feb 24, 1987·9 cites·10 claims
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