Inventor · disambiguated record
Lan-Kai Yeh
Also filed as: YEH LAN-KAI
6 granted patents·3 pending applications·72 citations·filing 2004–2012
83Inventor score
Top patents by PatentIndex Score
9 records- 0184US7237337B2Heat dissipating apparatus having micro-structure layer and method of fabricating the sameIND TECH RES INST·Filed 2004·Granted Jul 3, 2007·32 cites·7 claims
- 0281US7730605B2Method of fabricating heat dissipating apparatusIND TECH RES INST·Filed 2007·Granted Jun 8, 2010·9 cites·15 claims
- 0381US7578338B2Heat dissipating apparatus having micro-structure layer and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Aug 25, 2009·9 cites·12 claims
- 0458US6932150B1Heat-dissipation deviceIND TECH RES INST·Filed 2004·Granted Aug 23, 2005·14 cites·12 claims
- 0557US7011145B2Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating deviceIND TECH RES INST·Filed 2004·Granted Mar 14, 2006·8 cites·9 claims
- 0639US8790149B2Method of fabricating flexible display deviceWANG CHUN-JAN·Filed 2012·Granted Jul 29, 2014·0 cites·14 claims
- 0736US2010229394A1Method for fabricating wick microstructures in heat pipesIND TECH RES INST·Filed 2010·Application pending·0 cites
- 0832US2006143916A1Method for fabricating wick microstructures in heat pipesIND TECH RES INST·Filed 2005·Application pending·0 cites
- 0930US2006021734A1Heat sink and heat spreader bonding structureCHANG SHIH-YING·Filed 2004·Application pending·0 cites
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