Inventor · disambiguated record

Setsuya Hama

Also filed as: HAMA Setsuya

2 granted patents·2 citations·filing 2017–2019

35Inventor score

Technology areasH10P

Files withSHINETSU HANDOTAI KK2

Top patents by PatentIndex Score

2 records

0171US10600677B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2017·Granted Mar 24, 2020·2 cites·4 claims
0242US11244852B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2019·Granted Feb 8, 2022·0 cites·8 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →