Inventor · disambiguated record
I-Hsin Mao
Also filed as: MAO I-HSIN
4 granted patents·1 pending application·118 citations·filing 2006–2013
77Inventor score
Technology areasH10W
Files withCHIPMOS TECHNOLOGIES INC5
Top patents by PatentIndex Score
5 records- 0197US7642137B2Manufacturing method of chip packageCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Jan 5, 2010·83 cites·7 claims
- 0293US7932531B2Chip packageCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Apr 26, 2011·29 cites·13 claims
- 0368US7446400B2Chip package structure and fabricating method thereofCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Nov 4, 2008·4 cites·8 claims
- 0466US8809088B2Structure of stacking chips and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Aug 19, 2014·2 cites·5 claims
- 0542US2007267756A1Integrated circuit package and multi-layer lead frame utilizedCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →