Inventor · disambiguated record
Chau-Jie Zhan
Also filed as: ZHAN CHAU-JIE
6 granted patents·2 pending applications·19 citations·filing 2009–2014
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0184US9391049B2Molding package assembly and molding materialIND TECH RES INST·Filed 2014·Granted Jul 12, 2016·8 cites·16 claims
- 0283US8130509B2Package carrierTSAI TSUNG-FU·Filed 2009·Granted Mar 6, 2012·11 cites·23 claims
- 0345US2012125669A1Package carrierTSAI TSUNG-FU·Filed 2012·Application pending·0 cites
- 0445US2010207266A1Chip package structureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 0542US9024441B2Bump structure and electronic packaging solder joint structure and fabricating method thereofLIN YU-MIN·Filed 2012·Granted May 5, 2015·0 cites·6 claims
- 0641US8415795B2Semiconductor device and assembling method thereofLIN YU-MIN·Filed 2011·Granted Apr 9, 2013·0 cites·14 claims
- 0737US8575754B2Micro-bump structureTSAI TSUNG-FU·Filed 2010·Granted Nov 5, 2013·0 cites·6 claims
- 0836US8598686B2Electronic device package structure with a hydrophilic protection layer and method for fabricating the sameCHANG TAO-CHIH·Filed 2010·Granted Dec 3, 2013·0 cites·25 claims
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