Inventor · disambiguated record
Richard K. Spielberger
Also filed as: SPIELBERGER RICHARD · SPIELBERGER RICHARD K
39 granted patents·1,451 citations·filing 1982–2008
98Inventor score
Top patents by PatentIndex Score
39 records- 0194US6005778AChip stacking and capacitor mounting arrangement including spacersHONEYWELL INC·Filed 1996·Granted Dec 21, 1999·294 cites·23 claims
- 0289US5998867ARadiation enhanced chip encapsulantHONEYWELL INC·Filed 1996·Granted Dec 7, 1999·116 cites·37 claims
- 0388US7078243B2Shielding arrangement to protect a circuit from stray magnetic fieldsMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 18, 2006·12 cites·8 claims
- 0488US6916668B2Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cellsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 12, 2005·36 cites·37 claims
- 0588US5066614AMethod of manufacturing a leadframe having conductive elements preformed with solder bumpsHONEYWELL INC·Filed 1990·Granted Nov 19, 1991·102 cites·9 claims
- 0687US6657134B2Stacked ball grid arrayHONEYWELL INT INC·Filed 2001·Granted Dec 2, 2003·55 cites·24 claims
- 0786US7736946B2System and method for sealing a MEMS deviceHONEYWELL INT INC·Filed 2007·Granted Jun 15, 2010·16 cites·20 claims
- 0885US7569915B2Shielding arrangement to protect a circuit from stray magnetic fieldsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 4, 2009·9 cites·9 claims
- 0984US6515352B1Shielding arrangement to protect a circuit from stray magnetic fieldsMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·27 cites·17 claims
- 1083US5644230AMiniature magnetometer and flexible circuitHONEYWELL INC·Filed 1996·Granted Jul 1, 1997·61 cites·8 claims
- 1181US5066831AUniversal semiconductor chip packageHONEYWELL INC·Filed 1989·Granted Nov 19, 1991·55 cites·14 claims
- 1280US5939772AShielded package for magnetic devicesHONEYWELL INC·Filed 1997·Granted Aug 17, 1999·61 cites·12 claims
- 1378US6169254B1Three axis sensor package on flexible substrateHONEYWELL INC·Filed 1994·Granted Jan 2, 2001·61 cites·16 claims
- 1473US5891745ATest and tear-away bond pad designHONEYWELL INC·Filed 1997·Granted Apr 6, 1999·44 cites·16 claims
- 1572US7635916B2Integrated circuit package with top-side conduction coolingHONEYWELL INT INC·Filed 2007·Granted Dec 22, 2009·5 cites·19 claims
- 1672US5140496ADirect microcircuit decouplingHONEYWELL INC·Filed 1991·Granted Aug 18, 1992·48 cites·12 claims
- 1771US5099306AStacked tab leadframe assemblyHONEYWELL INC·Filed 1991·Granted Mar 24, 1992·47 cites·45 claims
- 1870US4898320AMethod of manufacturing a high-yield solder bumped semiconductor waferHONEYWELL INC·Filed 1988·Granted Feb 6, 1990·35 cites·17 claims
- 1967US5498900ASemiconductor package with weldable ceramic lidHONEYWELL INC·Filed 1993·Granted Mar 12, 1996·36 cites·4 claims
- 2064US5036163AUniversal semiconductor chip packageHONEYWELL INC·Filed 1990·Granted Jul 30, 1991·34 cites·6 claims
- 2161US4948032AFluxing agentATMEL CORP·Filed 1988·Granted Aug 14, 1990·24 cites·12 claims
- 2260US5010387ASolder bonding materialHONEYWELL INC·Filed 1988·Granted Apr 23, 1991·15 cites·14 claims
- 2360US4980753ALow-cost high-performance semiconductor chip packageHONEYWELL INC·Filed 1988·Granted Dec 25, 1990·25 cites·26 claims
- 2458US6027948AMethod to permit high temperature assembly processes for magnetically sensitive devicesHONEYWELL INT INC·Filed 1997·Granted Feb 22, 2000·24 cites·14 claims
- 2558US4979289AMethod of die bonding semiconductor chip by using removable non-wettable by solder frameHONEYWELL INC·Filed 1989·Granted Dec 25, 1990·23 cites·8 claims
- 2657US4999700APackage to board variable pitch tabHONEYWELL INC·Filed 1989·Granted Mar 12, 1991·22 cites·2 claims
- 2756US5139610AMethod of making a surface etched shadow maskHONEYWELL INC·Filed 1990·Granted Aug 18, 1992·26 cites·14 claims
- 2855US5161729APackage to semiconductor chip active interconnect site methodHONEYWELL INC·Filed 1991·Granted Nov 10, 1992·23 cites·3 claims
- 2954US4528446AOptoelectronic lens array with an integrated circuitHONEYWELL INC·Filed 1982·Granted Jul 9, 1985·15 cites·22 claims
- 3051US6611054B1IC package lid for dose enhancement protectionHONEYWELL INC·Filed 1993·Granted Aug 26, 2003·18 cites·12 claims
- 3149US5719748ASemiconductor package with a bridge for chip area connectionHONEYWELL INC·Filed 1995·Granted Feb 17, 1998·17 cites·10 claims
- 3249US5043533AChip package capacitor coverHONEYWELL INC·Filed 1989·Granted Aug 27, 1991·15 cites·20 claims
- 3346US4982267AIntegrated semiconductor packageATMEL CORP·Filed 1987·Granted Jan 1, 1991·17 cites·8 claims
- 3445US7965094B2Packaged die heaterHONEYWELL INT INC·Filed 2008·Granted Jun 21, 2011·0 cites·20 claims
- 3545US5074036AMethod of die bonding semiconductor chip by using removable frameHONEYWELL INC·Filed 1990·Granted Dec 24, 1991·15 cites·6 claims
- 3639US7863720B2Method and system for stacking integrated circuitsHONEYWELL INT INC·Filed 2004·Granted Jan 4, 2011·0 cites·17 claims
- 3736US5101550ARemovable drop-through die bond frameHONEYWELL INC·Filed 1991·Granted Apr 7, 1992·7 cites·8 claims
- 3835US5061822ARadial solution to chip carrier pitch deviationHONEYWELL INC·Filed 1990·Granted Oct 29, 1991·6 cites·13 claims
- 3934US4980240ASurface etched shadow maskHONEYWELL INC·Filed 1989·Granted Dec 25, 1990·5 cites·4 claims
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