Inventor · disambiguated record
Yoshijiro Ushio
Also filed as: USHIO YOSHIJIRO
16 granted patents·1 pending application·936 citations·filing 1991–2012
95Inventor score
Top patents by PatentIndex Score
17 records- 0197US6670200B2Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising sameNIKON CORP·Filed 2001·Granted Dec 30, 2003·129 cites·9 claims
- 0297US6271047B1Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising sameNIKON CORP·Filed 1999·Granted Aug 7, 2001·239 cites·15 claims
- 0395US6458014B1Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing methodNIKON CORP·Filed 2001·Granted Oct 1, 2002·125 cites·31 claims
- 0493US7052920B2Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising sameNIKON CORP·Filed 2001·Granted May 30, 2006·62 cites·15 claims
- 0592US6489624B1Apparatus and methods for detecting thickness of a patterned layerNIKON CORP·Filed 1998·Granted Dec 3, 2002·115 cites·32 claims
- 0689US5148306AElectrochromic device with specific resistancesNIKON CORP·Filed 1991·Granted Sep 15, 1992·96 cites·12 claims
- 0783US6102775AFilm inspection methodNIKON CORP·Filed 1998·Granted Aug 15, 2000·59 cites·6 claims
- 0877US8791989B2Image processing apparatus, image processing method, recording method, and recording mediumUSHIO YOSHIJIRO·Filed 2011·Granted Jul 29, 2014·4 cites·26 claims
- 0975US6679756B2Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor deviceNIKON CORP·Filed 2000·Granted Jan 20, 2004·17 cites·15 claims
- 1075US6108096ALight absorption measurement apparatus and methodsNIKON CORP·Filed 1998·Granted Aug 22, 2000·43 cites·38 claims
- 1165US7108580B2Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor deviceNIKON CORP·Filed 2004·Granted Sep 19, 2006·10 cites·7 claims
- 1263US8675048B2Image processing apparatus, image processing method, recording method, and recording mediumUSHIO YOSHIJIRO·Filed 2011·Granted Mar 18, 2014·1 cites·24 claims
- 1357US5673114AApparatus for measuring optical absorption of sample and sample holder applicable to the sameNIKON CORP·Filed 1996·Granted Sep 30, 1997·20 cites·36 claims
- 1447US5641597ACircuit forming method and apparatus thereforNIKON CORP·Filed 1995·Granted Jun 24, 1997·8 cites·8 claims
- 1541US2012194905A1Image display apparatus and image display methodUSHIO YOSHIJIRO·Filed 2012·Application pending·0 cites
- 1639US7203564B2Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing methodNIKON CORP·Filed 2004·Granted Apr 10, 2007·0 cites·21 claims
- 1739US5933181APhotographic recording apparatusFUTABA DENSHI KOGYO KK·Filed 1996·Granted Aug 3, 1999·8 cites·4 claims
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