Inventor · disambiguated record
Amornthep Saiyajitara
Also filed as: Saiyajitara Amornthep
12 granted patents·5 pending applications·14 citations·filing 2016–2025
83Inventor score
Top patents by PatentIndex Score
17 records- 0183US10340211B1Sensor module with blade insertNXP BV·Filed 2018·Granted Jul 2, 2019·5 cites·20 claims
- 0279US10249556B1Lead frame with partially-etched connecting barNXP BV·Filed 2018·Granted Apr 2, 2019·5 cites·18 claims
- 0376US10790220B2Press-fit semiconductor deviceNXP BV·Filed 2018·Granted Sep 29, 2020·3 cites·20 claims
- 0467US2025266335A1Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2025·Application pending·0 cites
- 0566US12406911B2Semiconductor device with embedded battery and method thereforNXP USA INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 0664US10847385B2Glob top encapsulation using molding tapeNXP BV·Filed 2018·Granted Nov 24, 2020·1 cites·15 claims
- 0760US2025132212A1Qfn packaged semiconductor device and methodNXP USA INC·Filed 2024·Application pending·0 cites
- 0857US2025210471A1Semiconductor chip packaging defect free dimple process and deviceNXP BV·Filed 2023·Application pending·0 cites
- 0954US11637024B2Method for glob top encapsulation using molding tape with elevated sidewallNXP BV·Filed 2020·Granted Apr 25, 2023·0 cites·11 claims
- 1052US12125771B2Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereofNXP BV·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 1150US11482478B2Shielded electronic package and method of fabricationNXP BV·Filed 2020·Granted Oct 25, 2022·0 cites·16 claims
- 1245US11114239B2Electronic device, device package, and method of fabricationNXP BV·Filed 2019·Granted Sep 7, 2021·0 cites·18 claims
- 1344US11049817B2Semiconductor device with integral EMI shieldNXP BV·Filed 2019·Granted Jun 29, 2021·0 cites·19 claims
- 1442US9721877B1Method of mounting passive electronic component on lead frameNexperia BV·Filed 2016·Granted Aug 1, 2017·0 cites·21 claims
- 1539US10763203B1Conductive trace design for smart cardNXP BV·Filed 2019·Granted Sep 1, 2020·0 cites·18 claims
- 1631US2019229044A1Lead frame with plated lead tipsNXP BV·Filed 2018·Application pending·0 cites
- 1728US2018226353A1Semiconductor lead frame with machine readable markNXP BV·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →