Inventor · disambiguated record
Mysore Purushotham Divakar
Also filed as: DIVAKAR MYSORE P · DIVAKAR MYSORE PURUSHOTHAM
11 granted patents·1 pending application·155 citations·filing 2003–2019
89Inventor score
Top patents by PatentIndex Score
12 records- 0189US6940724B2DC-DC converter implemented in a land grid array packagePOWER ONE LTD·Filed 2003·Granted Sep 6, 2005·64 cites·17 claims
- 0285US7026664B2DC-DC converter implemented in a land grid array packagePOWER ONE INC·Filed 2003·Granted Apr 11, 2006·44 cites·12 claims
- 0383US8047865B2Pluggable cable connectorPANDUIT CORP·Filed 2009·Granted Nov 1, 2011·16 cites·11 claims
- 0474US8358508B2Active patch panelPANDUIT CORP·Filed 2010·Granted Jan 22, 2013·3 cites·11 claims
- 0562US8172602B2Pluggable cable connectorPATEL SATISH I·Filed 2011·Granted May 8, 2012·3 cites·5 claims
- 0662US6946744B2System and method of reducing die attach stress and strainPOWER ONE LTD·Filed 2003·Granted Sep 20, 2005·11 cites·39 claims
- 0757US7027305B2Arrangement for surface mounting of subassemblies on a mother boardPOWER ONE INC·Filed 2003·Granted Apr 11, 2006·10 cites·10 claims
- 0851US8298002B2Pluggable cable connectorPATEL SATISH I·Filed 2012·Granted Oct 30, 2012·1 cites·6 claims
- 0950US8737079B2Active patch panelPANDUIT CORP·Filed 2013·Granted May 27, 2014·0 cites·3 claims
- 1050US7145085B2Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother boardPOWER ONE INC·Filed 2004·Granted Dec 5, 2006·3 cites·6 claims
- 1148US10734302B2Method and apparatus of operating a compressible thermal interfaceKULR TECH CORPORATION·Filed 2019·Granted Aug 4, 2020·0 cites·10 claims
- 1237US2005161806A1Area array packages with overmolded pin-fin heat sinksFiled 2004·Application pending·0 cites
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