Inventor · disambiguated record
Steven A. Cordes
Also filed as: CORDES STEVEN · CORDES STEVEN A · CORDES STEVEN ALAN
53 granted patents·6 pending applications·742 citations·filing 1997–2022
98Inventor score
Top patents by PatentIndex Score
59 records- 0196US6332569B1Etched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 2000·Granted Dec 25, 2001·97 cites·12 claims
- 0292US10424185B2Responding to personal danger using a mobile electronic deviceIBM·Filed 2017·Granted Sep 24, 2019·13 cites·20 claims
- 0392US6614109B2Method and apparatus for thermal management of integrated circuitsIBM·Filed 2000·Granted Sep 2, 2003·72 cites·14 claims
- 0491US7497366B2Global vacuum injection molded solder system and methodIBM·Filed 2007·Granted Mar 3, 2009·17 cites·1 claims
- 0591US6105852AEtched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 1998·Granted Aug 22, 2000·73 cites·7 claims
- 0690US6384312B1Thermoelectric coolers with enhanced structured interfacesIBM·Filed 2000·Granted May 7, 2002·65 cites·20 claims
- 0788US7416104B2Rotational fill techniques for injection molding of solderIBM·Filed 2006·Granted Aug 26, 2008·14 cites·1 claims
- 0886US7810033B2Methods and systems involving text analysisIBM·Filed 2007·Granted Oct 5, 2010·20 cites·13 claims
- 0986US6893902B2Method and apparatus for thermal management of integrated circuitsIBM·Filed 2002·Granted May 17, 2005·38 cites·12 claims
- 1083US8933717B2Probe-on-substrateAUDETTE DAVID M·Filed 2012·Granted Jan 13, 2015·5 cites·23 claims
- 1183US8551816B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2012·Granted Oct 8, 2013·6 cites·6 claims
- 1283US7516879B1Method of producing coaxial solder bump connections using injection molding of solderIBM·Filed 2008·Granted Apr 14, 2009·10 cites·1 claims
- 1383US7410092B2Fill head for injection molding of solderIBM·Filed 2006·Granted Aug 12, 2008·10 cites·1 claims
- 1483US6390439B1Hybrid molds for molten solder screening processIBM·Filed 1999·Granted May 21, 2002·44 cites·40 claims
- 1582US7506794B1High-temperature alloy standoffs for injection molding of solderIBM·Filed 2008·Granted Mar 24, 2009·10 cites·1 claims
- 1681US6192100B1X-ray mask pellicles and their attachment in semiconductor manufacturingIBM·Filed 1999·Granted Feb 20, 2001·47 cites·18 claims
- 1780US7410090B2Conductive bonding material fill techniquesIBM·Filed 2006·Granted Aug 12, 2008·7 cites·20 claims
- 1880US6798953B1Guides lithographically fabricated on semiconductor devicesIBM·Filed 2000·Granted Sep 28, 2004·23 cites·21 claims
- 1978US6832747B2Hybrid molds for molten solder screening processIBM·Filed 2002·Granted Dec 21, 2004·18 cites·17 claims
- 2076US6426241B1Method for forming three-dimensional circuitization and circuits formedIBM·Filed 1999·Granted Jul 30, 2002·39 cites·44 claims
- 2174US6562642B1Micro-structures and methods for their manufactureIBM·Filed 2002·Granted May 13, 2003·13 cites·38 claims
- 2273US8237271B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2007·Granted Aug 7, 2012·5 cites·10 claims
- 2373US7385457B2Flexible capacitive coupler assembly and method of manufactureIBM·Filed 2006·Granted Jun 10, 2008·4 cites·19 claims
- 2473US6613602B2Method and system for forming a thermoelement for a thermoelectric coolerIBM·Filed 2001·Granted Sep 2, 2003·30 cites·22 claims
- 2572US7784673B2Rotational fill techniques for injection molding of solderIBM·Filed 2008·Granted Aug 31, 2010·4 cites·20 claims
- 2671US6713827B2Micro-structures and methods for their manufactureIBM·Filed 2003·Granted Mar 30, 2004·11 cites·9 claims
- 2770US9057741B2Probe-on-substrateAUDETTE DAVID M·Filed 2012·Granted Jun 16, 2015·2 cites·25 claims
- 2867US7669748B2Conductive bonding material fill techniquesIBM·Filed 2008·Granted Mar 2, 2010·1 cites·6 claims
- 2966US7810702B2Solder standoffs for injection molding of solderIBM·Filed 2008·Granted Oct 12, 2010·1 cites·1 claims
- 3065US7688095B2Interposer structures and methods of manufacturing the sameIBM·Filed 2007·Granted Mar 30, 2010·2 cites·15 claims
- 3165US7456640B2Structure for coupling probes of probe device to corresponding electrical contacts on product substrateIBM·Filed 2006·Granted Nov 25, 2008·6 cites·20 claims
- 3264US7784664B2Fill head for injection molding of solderIBM·Filed 2008·Granted Aug 31, 2010·2 cites·1 claims
- 3362US6350625B1Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereofIBM·Filed 2000·Granted Feb 26, 2002·6 cites·35 claims
- 3460US10324994B2Flow-directed collaborative communicationIBM·Filed 2018·Granted Jun 18, 2019·0 cites·20 claims
- 3559US6679625B2Scanning heat flow probeIBM·Filed 2001·Granted Jan 20, 2004·6 cites·8 claims
- 3658US9953090B2Flow-directed collaborative communicationIBM·Filed 2017·Granted Apr 24, 2018·0 cites·18 claims
- 3757US8159248B2Interposer structures and methods of manufacturing the sameCORDES STEVEN A·Filed 2009·Granted Apr 17, 2012·2 cites·19 claims
- 3856US9433101B2Substrate via fillingIBM·Filed 2014·Granted Aug 30, 2016·0 cites·1 claims
- 3955US9679023B2Flow-directed collaborative communicationIBM·Filed 2015·Granted Jun 13, 2017·0 cites·20 claims
- 4055US9270739B2Flow-directed collaborative communicationIBM·Filed 2013·Granted Feb 23, 2016·0 cites·20 claims
- 4154US9258356B2Flow-directed collaborative communicationIBM·Filed 2013·Granted Feb 9, 2016·0 cites·19 claims
- 4254US8576170B2Joystick type computer input device with mouseCORDES STEVEN ALAN·Filed 2011·Granted Nov 5, 2013·2 cites·12 claims
- 4352US9872394B2Substrate via fillingIBM·Filed 2016·Granted Jan 16, 2018·0 cites·18 claims
- 4452US6652139B2Scanning heat flow probe and the method of fabricating the sameIBM·Filed 2003·Granted Nov 25, 2003·3 cites·8 claims
- 4552US2008238582A1Flexible Capacitive Coupler Assembly And Method Of ManufactureIBM·Filed 2008·Application pending·0 cites
- 4650US2024198848A1Predicting charging behavior of electric vehicle driversIBM·Filed 2022·Application pending·0 cites
- 4749US6817761B2Scanning heat flow probeIBM·Filed 2003·Granted Nov 16, 2004·2 cites·4 claims
- 4849US5756236AFabrication of high resolution aluminum ablation masksIBM·Filed 1997·Granted May 26, 1998·11 cites·28 claims
- 4947US8081280B2Method of producing UV stable liquid crystal alignmentCHIU GEORGE LIANG-TAI·Filed 2007·Granted Dec 20, 2011·0 cites·22 claims
- 5047US6866415B2Scanning heat flow probeIBM·Filed 2003·Granted Mar 15, 2005·1 cites·5 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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