Inventor · disambiguated record
Kazuhiro Shimeno
Also filed as: SHIMENO KAZUHIRO
4 granted patents·5 pending applications·212 citations·filing 1986–2012
82Inventor score
Files withKOKUSAI ELECTRIC CO LTD3HITACHI INT ELECTRIC INC2HITACHI KOKUSAI ELECTRIC INC H1NIPPON KOGAKU KK1SHIMADA TOSHIYA1
Top patents by PatentIndex Score
9 records- 0187US4710604AMachining apparatus with laser beamNIPPON KOGAKU KK·Filed 1986·Granted Dec 1, 1987·53 cites·14 claims
- 0284US5669644AWafer transfer plateKOKUSAI ELECTRIC CO LTD·Filed 1995·Granted Sep 23, 1997·90 cites·16 claims
- 0367US5960159AHeat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entiretyKOKUSAI ELECTRIC CO LTD·Filed 1997·Granted Sep 28, 1999·37 cites·20 claims
- 0460US6318944B1Semiconductor fabricating apparatus, method for modifying positional displacement of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassetteKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Nov 20, 2001·32 cites·10 claims
- 0547US2006075972A1Substrate processing apparatus and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 0638US2012329290A1Substrate Placement Stage, Substrate Processing Apparatus and Method of Manufacturing Semiconductor DeviceSHIMADA TOSHIYA·Filed 2012·Application pending·0 cites
- 0737US2004026036A1Substrate processing apparatus and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2003·Application pending·0 cites
- 0837US2002017363A1Substrate processing apparatus and substrate processing methodFiled 2001·Application pending·0 cites
- 0934US2001050146A1Substrate processing apparatus and substrate processing methodHITACHI KOKUSAI ELECTRIC INC H·Filed 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →