Inventor · disambiguated record
Jung Soo Byun
Also filed as: BYUN JUNG SOO
14 granted patents·7 pending applications·78 citations·filing 2008–2021
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8SAMSUNG ELECTRO MECH5LEE SANG CHUL2BAEK SANG JIN1BYUN JUNG-SOO1
Top patents by PatentIndex Score
21 records- 0196US10665535B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 26, 2020·17 cites·22 claims
- 0293US10446478B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·12 cites·20 claims
- 0389US8339796B2Embedded printed circuit board and method of manufacturing the sameLEE SANG CHUL·Filed 2010·Granted Dec 25, 2012·10 cites·4 claims
- 0488US11189552B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 0583US10438884B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·3 cites·14 claims
- 0682US8942004B2Printed circuit board having electronic components embedded thereinHONG SUK CHANG·Filed 2010·Granted Jan 27, 2015·13 cites·10 claims
- 0781US10916495B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·3 cites·16 claims
- 0878US9392698B2Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCBSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 12, 2016·6 cites·9 claims
- 0975US8645183B2System for assessing an environmental load of building during life cycleSHIN SUNG WOO·Filed 2011·Granted Feb 4, 2014·4 cites·7 claims
- 1073US10796997B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·17 claims
- 1173US8881382B2Embedded printed circuit board and method of manufacturing the sameLEE SANG CHUL·Filed 2011·Granted Nov 11, 2014·3 cites·8 claims
- 1271US10790224B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·1 cites·18 claims
- 1367US11699643B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·12 claims
- 1460US8618421B2Electronics component embedded PCBBYUN JUNG-SOO·Filed 2010·Granted Dec 31, 2013·2 cites·3 claims
- 1553US2015049445A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1650US2015085455A1Electronic component-embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1748US2009310323A1Printed circuit board including electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1847US2016212856A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1942US2011314667A1Method of manufacturing printed circuit board including electronic component embedded thereinBAEK SANG JIN·Filed 2011·Application pending·0 cites
- 2038US2013119553A1Semiconductor package and method of manufacturing the sameJEONG TAE SUNG·Filed 2012·Application pending·0 cites
- 2133US2012160549A1Printed circuit board having embedded electronic component and method of manufacturing the sameKIM MOON IL·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →