Inventor · disambiguated record
Seiichi Yoshinaga
Also filed as: YOSHINAGA SEIICHI
3 granted patents·3 pending applications·30 citations·filing 1994–2010
63Inventor score
Top patents by PatentIndex Score
6 records- 0162US8686299B2Electronic element unit and reinforcing adhesive agentMOTOMURA KOJI·Filed 2010·Granted Apr 1, 2014·2 cites·5 claims
- 0262US5505366AMethod for mounting electronic devicesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Apr 9, 1996·28 cites·5 claims
- 0341US2006043597A1Solder composition, connecting process with soldering, and connection structure with solderingWADA YOSHIYUKI·Filed 2005·Application pending·0 cites
- 0441US2006043543A1Solder composition, connecting process with soldering, and connection structure with solderingWADA YOSHIYUKI·Filed 2005·Application pending·0 cites
- 0538US8759688B2Electronic component mounting structureYOSHINAGA SEIICHI·Filed 2007·Granted Jun 24, 2014·0 cites·5 claims
- 0627US2011315321A1Resin application apparatus and data creation apparatus for resin applicationYOSHINAGA SEIICHI·Filed 2010·Application pending·0 cites
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