Inventor · disambiguated record
Yoon Joo Kim
Also filed as: KIM YOON JOO
38 granted patents·9 pending applications·345 citations·filing 2005–2025
97Inventor score
Files withAMKOR TECHNOLOGY INC17HYUNDAI MOTOR CO LTD16AMKOR TECH SINGAPORE HOLDING PTE LTD4SAMSUNG ELECTRONICS CO LTD4KIA MOTORS CORP2
Top patents by PatentIndex Score
47 records- 0199US7170183B1Wafer level stacked packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·146 cites·17 claims
- 0295US9831282B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 28, 2017·9 cites·20 claims
- 0395US7723852B1Stacked semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted May 25, 2010·39 cites·18 claims
- 0494US9431447B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
- 0594US8946883B2Wafer level fan-out package with a fiducial dieAMKOR TECHNOLOGY INC·Filed 2013·Granted Feb 3, 2015·23 cites·20 claims
- 0693US9129873B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 8, 2015·10 cites·20 claims
- 0792US10304890B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·5 cites·22 claims
- 0892US7633144B1Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Dec 15, 2009·24 cites·15 claims
- 0990US10692918B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 23, 2020·3 cites·20 claims
- 1089US12230661B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 18, 2025·0 cites·20 claims
- 1189US7956453B1Semiconductor package with patterning layer and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted Jun 7, 2011·15 cites·19 claims
- 1288US7906855B1Stacked semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2010·Granted Mar 15, 2011·9 cites·20 claims
- 1386US7408254B1Stack land grid array package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2005·Granted Aug 5, 2008·16 cites·20 claims
- 1484US9187073B2Negative pressure forming device for brake of vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Nov 17, 2015·5 cites·9 claims
- 1583US9478517B2Electronic device package structure and method of fabricating the sameAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 25, 2016·6 cites·20 claims
- 1681US11961867B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1780US2025160031A1Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1877US10331208B2Method for outputting image and electronic device supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 25, 2019·3 cites·16 claims
- 1975US9322362B2Supercharging system for engineHYUNDAI MOTOR CO LTD·Filed 2013·Granted Apr 26, 2016·5 cites·12 claims
- 2074US11362128B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 2170US9406639B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Aug 2, 2016·2 cites·29 claims
- 2268US9418942B2Semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·2 cites·20 claims
- 2368US7847398B2Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturingAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 7, 2010·4 cites·16 claims
- 2466US8129849B1Method of making semiconductor package with adhering portionKIM YOUN SANG·Filed 2009·Granted Mar 6, 2012·4 cites·21 claims
- 2563US11244422B2Image processing apparatus and image processing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 8, 2022·1 cites·13 claims
- 2662US8729710B1Semiconductor package with patterning layer and method of making sameKIM DO HYEONG·Filed 2011·Granted May 20, 2014·2 cites·10 claims
- 2753US7963478B2Wing-flapping flying apparatus and method of using the sameKOREA INST SCI & TECH·Filed 2006·Granted Jun 21, 2011·4 cites·5 claims
- 2851US9133760B2Brake negative pressure generating device for vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Sep 15, 2015·0 cites·6 claims
- 2950US10115705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 30, 2018·0 cites·18 claims
- 3050US9903317B2Control apparatus of engine having turbocharger and method thereofHYUNDAI MOTOR CO LTD·Filed 2014·Granted Feb 27, 2018·0 cites·8 claims
- 3150US9816432B2Engine cooling systemHYUNDAI MOTOR CO LTD·Filed 2014·Granted Nov 14, 2017·0 cites·15 claims
- 3248US9464597B2Engine systemHYUNDAI MOTOR CO LTD·Filed 2013·Granted Oct 11, 2016·0 cites·9 claims
- 3347US9874155B2Method of controlling electric continuous variable valve timing apparatusHYUNDAI MOTOR CO LTD·Filed 2013·Granted Jan 23, 2018·0 cites·10 claims
- 3447US2014216422A1Method of controlling engineHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 3546US9494076B2Engine systemHYUNDAI MOTOR CO LTD·Filed 2014·Granted Nov 15, 2016·0 cites·15 claims
- 3646US2014165960A1Variable intake manifold for internal combustion engine and variable air intake device using the sameKIA MOTORS CORP·Filed 2013·Application pending·0 cites
- 3746US2015020522A1Engine systemHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 3844US10408124B2Control method for turbochargerHYUNDAI MOTOR CO LTD·Filed 2014·Granted Sep 10, 2019·0 cites·9 claims
- 3944US9599044B2Control apparatus for engine having turbocharger and method thereofHYUNDAI MOTOR CO LTD·Filed 2014·Granted Mar 21, 2017·0 cites·2 claims
- 4043US9890749B2Method for controlling exhaust gas recirculation system for engineHYUNDAI MOTOR CO LTD·Filed 2015·Granted Feb 13, 2018·0 cites·3 claims
- 4143US2014230417A1Exhaust gas combustion systemHYUNDAI MOTOR CO LTD·Filed 2013·Application pending·0 cites
- 4242US2014162407A1Method And System For Semiconductor PackagingZWENGER CURTIS MICHAEL·Filed 2012·Application pending·0 cites
- 4341US10650596B2Electronic device for providing VR image based on polyhedron and image providing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·0 cites·20 claims
- 4441US2014165959A1Engine having variable valve timing device and variable tumble deviceKIA MOTORS CORP·Filed 2013·Application pending·0 cites
- 4541US2015143807A1Engine having turbo chargerHYUNDAI MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 4638US2016153337A1Engine system having turbochargerHYUNDAI MOTOR CO LTD·Filed 2015·Application pending·0 cites
- 4737US11017598B2Method for processing omni-directional image using padding area and apparatus supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 25, 2021·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →