Inventor · disambiguated record
Roger D. Weekly
Also filed as: WEEKLY ROGER · WEEKLY ROGER D · WEEKLY ROGER DONELL
60 granted patents·1 pending application·280 citations·filing 2000–2019
98Inventor score
Top patents by PatentIndex Score
61 records- 0191US8338948B2Ball grid array with improved single-ended and differential signal performanceWEEKLY ROGER D·Filed 2010·Granted Dec 25, 2012·12 cites·2 claims
- 0291US7863106B2Silicon interposer testing for three dimensional chip stackIBM·Filed 2008·Granted Jan 4, 2011·18 cites·22 claims
- 0390US7646082B2Multi-layer circuit substrate and method having improved transmission line integrity and increased routing densityIBM·Filed 2007·Granted Jan 12, 2010·15 cites·16 claims
- 0487US7765504B2Design method and system for minimizing blind via current loopsIBM·Filed 2007·Granted Jul 27, 2010·15 cites·30 claims
- 0587US7467050B2Method for detecting noise events in systems with time variable operating pointsIBM·Filed 2006·Granted Dec 16, 2008·16 cites·10 claims
- 0686US7720621B2Application of multiple voltage droop detectionIBM·Filed 2007·Granted May 18, 2010·15 cites·14 claims
- 0785US8399981B2Ball grid array with improved single-ended and differential signal performanceWEEKLY ROGER D·Filed 2012·Granted Mar 19, 2013·6 cites·5 claims
- 0882US7599808B2Application of multiple voltage droop detection and instruction throttling instances with customized thresholds across a semiconductor chipIBM·Filed 2007·Granted Oct 6, 2009·11 cites·12 claims
- 0982US7430800B2Apparatus and method for far end noise reduction using capacitive cancellation by offset wiringIBM·Filed 2005·Granted Oct 7, 2008·9 cites·11 claims
- 1081US8927879B2Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structuresCHOI JINWOO·Filed 2010·Granted Jan 6, 2015·4 cites·7 claims
- 1181US8624297B2Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing densityCHUN SUNGJUN·Filed 2009·Granted Jan 7, 2014·7 cites·9 claims
- 1280US7818599B2Statistical switched capacitor droop sensor for application in power distribution noise mitigationIBM·Filed 2007·Granted Oct 19, 2010·10 cites·25 claims
- 1379US7338818B2Systems and arrangements to assess thermal performanceIBM·Filed 2005·Granted Mar 4, 2008·11 cites·20 claims
- 1478US9456498B2Electronic module power supplyIBM·Filed 2013·Granted Sep 27, 2016·2 cites·14 claims
- 1578US8645889B2Noise coupling reduction and impedance discontinuity control in high-speed ceramic modulesCHOI JINWOO·Filed 2012·Granted Feb 4, 2014·4 cites·11 claims
- 1678US7607028B2Mitigate power supply noise response by throttling execution units based upon voltage sensingIBM·Filed 2006·Granted Oct 20, 2009·9 cites·20 claims
- 1777US8288657B2Noise coupling reduction and impedance discontinuity control in high-speed ceramic modulesCHOI JINWOO·Filed 2009·Granted Oct 16, 2012·6 cites·13 claims
- 1876US8742565B2Ball grid array with improved single-ended and differential signal performanceWEEKLY ROGER D·Filed 2012·Granted Jun 3, 2014·3 cites·9 claims
- 1976US7917328B2Tracking thermal mini-cycle stressIBM·Filed 2008·Granted Mar 29, 2011·8 cites·20 claims
- 2075US6617243B1Routing for multilayer ceramic substrates to reduce excessive via depthIBM·Filed 2000·Granted Sep 9, 2003·18 cites·9 claims
- 2172US8813000B2System for designing substrates having reference plane voids with strip segmentsIBM·Filed 2013·Granted Aug 19, 2014·1 cites·2 claims
- 2272US8572840B2Method of attaching an electronic module power supplyCHRISTO MICHAEL A·Filed 2010·Granted Nov 5, 2013·2 cites·3 claims
- 2371US6769108B2Triangular assignment of pins used for diagonal interconnections between diagonal chips in a multi-chip moduleIBM·Filed 2002·Granted Jul 27, 2004·13 cites·4 claims
- 2469US9955567B2Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structuresIBM·Filed 2014·Granted Apr 24, 2018·1 cites·10 claims
- 2569US8962475B2Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing densityIBM·Filed 2013·Granted Feb 24, 2015·1 cites·4 claims
- 2669US8619432B2Implementing high-speed signaling via dedicated printed circuit-board mediaBASKA DOUGLAS A·Filed 2010·Granted Dec 31, 2013·2 cites·18 claims
- 2769US7821796B2Reference plane voids with strip segment for improving transmission line integrity over viasIBM·Filed 2008·Granted Oct 26, 2010·2 cites·13 claims
- 2869US7734444B2Systems and arrangements to assess thermal performanceIBM·Filed 2007·Granted Jun 8, 2010·6 cites·18 claims
- 2969US7671273B2Method and apparatus for facilitating signal transmission using differential transmission linesIBM·Filed 2007·Granted Mar 2, 2010·4 cites·17 claims
- 3068US8214658B2Enhanced thermal management for improved module reliabilityCASEY JON A·Filed 2008·Granted Jul 3, 2012·4 cites·22 claims
- 3168US7376914B2Method and computer program product for designing power distribution system in a circuitIBM·Filed 2006·Granted May 20, 2008·4 cites·2 claims
- 3267US8446738B2Motherboard assembly for interconnecting and distributing signals and powerCOLBERT JOHN L·Filed 2009·Granted May 21, 2013·3 cites·14 claims
- 3366US7849427B2Auto-router performing simultaneous placement of signal and return pathsIBM·Filed 2008·Granted Dec 7, 2010·4 cites·20 claims
- 3465US10765002B2Electronic module power supplyIBM·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 3565US8958214B2Motherboard assembly for interconnecting and distributing signals and powerCOLBERT JOHN L·Filed 2012·Granted Feb 17, 2015·1 cites·10 claims
- 3665US8295058B2Structure for enhancing reference return current conductionCAHILL JOSEPH J·Filed 2009·Granted Oct 23, 2012·4 cites·24 claims
- 3764US7920978B2Method for detecting noise events in systems with time variable operating pointsIBM·Filed 2008·Granted Apr 5, 2011·2 cites·9 claims
- 3863US10362674B2Electronic module power supplyIBM·Filed 2018·Granted Jul 23, 2019·0 cites·4 claims
- 3963US10034393B2Implementing high-speed signaling via dedicated printed circuit-board mediaIBM·Filed 2013·Granted Jul 24, 2018·1 cites·11 claims
- 4063US7460986B2System DC Analysis MethodologyIBM·Filed 2006·Granted Dec 2, 2008·2 cites·8 claims
- 4162US11076493B2Implementing high-speed signaling via dedicated printed circuit-board mediaIBM·Filed 2018·Granted Jul 27, 2021·0 cites·10 claims
- 4261US7614141B2Fabricating substrates having low inductance via arrangementsIBM·Filed 2006·Granted Nov 10, 2009·2 cites·7 claims
- 4361US7050478B1Apparatus and method for synchronizing clock modulation with power supply modulation in a spread spectrum clock systemIBM·Filed 2000·Granted May 23, 2006·8 cites·10 claims
- 4460US8451020B2System and method for integrated circuit module tamperproof mode personalizationWEEKLY ROGER D·Filed 2010·Granted May 28, 2013·1 cites·20 claims
- 4560US6885098B2Routing for multilayer ceramic substrates to reduce excessive via depthIBM·Filed 2003·Granted Apr 26, 2005·7 cites·7 claims
- 4658US10080285B2Electronic module power supplyIBM·Filed 2016·Granted Sep 18, 2018·0 cites·11 claims
- 4758US8638567B2Circuit manufacturing and design techniques for reference plane voids with strip segmentCHUN SUNGJUN·Filed 2012·Granted Jan 28, 2014·0 cites·2 claims
- 4858US8625300B2Circuit manufacturing and design techniques for reference plane voids with strip segmentCHUN SUNGJUN·Filed 2012·Granted Jan 7, 2014·0 cites·2 claims
- 4958US7786579B2Apparatus for crack prevention in integrated circuit packagesIBM·Filed 2007·Granted Aug 31, 2010·1 cites·4 claims
- 5055US7017139B2Triangular assignment of pins used for diagonal interconnections between diagonal chips in a multi-chip moduleIBM·Filed 2004·Granted Mar 21, 2006·3 cites·12 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →