Inventor · disambiguated record
Takeshi Furusawa
Also filed as: FURUSAWA TAKESHI
43 granted patents·13 pending applications·688 citations·filing 1980–2023
98Inventor score
Top patents by PatentIndex Score
56 records- 0199US5609511APolishing methodHITACHI LTD·Filed 1995·Granted Mar 11, 1997·413 cites·13 claims
- 0298US11811385B2Bulk acoustic wave component with conductor extending laterally from viaSKYWORKS SOLUTIONS INC·Filed 2022·Granted Nov 7, 2023·4 cites·20 claims
- 0397US11588465B2Stacked temperature compensated acoustic wave device with high thermal conductivitySKYWORKS SOLUTIONS INC·Filed 2020·Granted Feb 21, 2023·8 cites·19 claims
- 0497US11581870B2Stacked acoustic wave resonator package with laser-drilled VIASSKYWORKS SOLUTIONS INC·Filed 2020·Granted Feb 14, 2023·8 cites·19 claims
- 0594US11496111B2Methods of plasma dicing bulk acoustic wave componentsSKYWORKS SOLUTIONS INC·Filed 2019·Granted Nov 8, 2022·6 cites·20 claims
- 0694US11251769B2Bulk acoustic wave componentsSKYWORKS SOLUTIONS INC·Filed 2019·Granted Feb 15, 2022·6 cites·22 claims
- 0794US9723729B2Printed wiring boardIBIDEN CO LTD·Filed 2015·Granted Aug 1, 2017·15 cites·20 claims
- 0892US7605448B2Semiconductor device with seal ringRENESAS TECH CORP·Filed 2005·Granted Oct 20, 2009·22 cites·35 claims
- 0988US6479380B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Nov 12, 2002·36 cites·22 claims
- 1084US6358838B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2001·Granted Mar 19, 2002·27 cites·23 claims
- 1183US12143091B2Methods of plasma dicing bulk acoustic wave componentsSKYWORKS SOLUTIONS INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1283US6777325B2Semiconductor manufacturing method for low-k insulating filmHITACHI LTD·Filed 2003·Granted Aug 17, 2004·20 cites·13 claims
- 1381US8018030B2Semiconductor chip with seal ring and sacrificial corner patternRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 13, 2011·7 cites·36 claims
- 1480US8513808B2Semiconductor device having trench-isolated element formation regionHOTTA KATSUHIKO·Filed 2011·Granted Aug 20, 2013·6 cites·13 claims
- 1580US7700487B2Semiconductor device and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Apr 20, 2010·7 cites·29 claims
- 1678US9713267B2Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive postIBIDEN CO LTD·Filed 2015·Granted Jul 18, 2017·4 cites·20 claims
- 1778US8487192B2Printed wiring board and method for manufacturing the sameKUNIEDA MASATOSHI·Filed 2010·Granted Jul 16, 2013·7 cites·18 claims
- 1877US8347493B2Wiring board with built-in electronic component and method of manufacturing sameIBIDEN CO LTD·Filed 2009·Granted Jan 8, 2013·8 cites·14 claims
- 1977US2024090123A1Nested filtersSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 2076US9497849B2Printed wiring boardIBIDEN CO LTD·Filed 2013·Granted Nov 15, 2016·4 cites·20 claims
- 2176US8203210B2Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layersFURUSAWA TAKESHI·Filed 2010·Granted Jun 19, 2012·4 cites·25 claims
- 2275US8963291B2Semiconductor chip with seal ring and sacrificial corner patternFURUSAWA TAKESHI·Filed 2011·Granted Feb 24, 2015·3 cites·8 claims
- 2375US6680541B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2002·Granted Jan 20, 2004·15 cites·8 claims
- 2474US4310176ASeat belt locking device for an automobile vehicleFUJI KIKO KK·Filed 1980·Granted Jan 12, 1982·27 cites·8 claims
- 2572US8975742B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Mar 10, 2015·3 cites·20 claims
- 2670US11765814B2Devices and methods related to nested filtersSKYWORKS SOLUTIONS INC·Filed 2019·Granted Sep 19, 2023·1 cites·5 claims
- 2768US9474158B2Printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Oct 18, 2016·2 cites·20 claims
- 2868US8772648B2Method for manufacturing printed wiring board and printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Jul 8, 2014·2 cites·14 claims
- 2968US6599830B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Jul 29, 2003·10 cites·38 claims
- 3067US9368459B2Semiconductor chip with seal ring and sacrificial corner patternRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 14, 2016·1 cites·1 claims
- 3167US7602063B2Semiconductor device and manufacturing method thereforRENESAS TECH CORP·Filed 2005·Granted Oct 13, 2009·2 cites·13 claims
- 3266US12407315B2Stacked filter package having multiple types of acoustic wave devicesSKYWORKS SOLUTIONS INC·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 3365US12301210B2Method of making stacked acoustic wave resonator package with laser-drilled viasSKYWORKS SOLUTIONS INC·Filed 2020·Granted May 13, 2025·0 cites·20 claims
- 3464US6903445B2Semiconductor device having low-K insulating filmRENESAS TECH CORP·Filed 2004·Granted Jun 7, 2005·4 cites·7 claims
- 3561US12375057B2Method of manufacturing a self-shielded acoustic wave device packageSKYWORKS SOLUTIONS INC·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 3660US9917025B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2015·Granted Mar 13, 2018·1 cites·20 claims
- 3757US8365402B2Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2009·Granted Feb 5, 2013·0 cites·20 claims
- 3857US7816268B2Semiconductor device and manufacturing method of semiconductor deviceRENESAS ELECRONICS CORP·Filed 2010·Granted Oct 19, 2010·1 cites·22 claims
- 3956US7960279B2Semiconductor device and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 14, 2011·0 cites·9 claims
- 4056US7379456B2Network routing apparatusHITACHI LTD·Filed 2004·Granted May 27, 2008·4 cites·18 claims
- 4150US2009184424A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 4248US2010236822A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2009·Application pending·0 cites
- 4348US2013241067A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 4448US2008230847A1Semiconductor device and manufacturing method of the sameFURUSAWA TAKESHI·Filed 2008·Application pending·0 cites
- 4547US8097948B2Semiconductor device and manufacturing method of semiconductor deviceFURUSAWA TAKESHI·Filed 2010·Granted Jan 17, 2012·0 cites·15 claims
- 4647US2012289032A1Semiconductor device and manufacturing method of the sameFURUSAWA TAKESHI·Filed 2012·Application pending·0 cites
- 4746US2010108371A1Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2009·Application pending·0 cites
- 4843US2007114668A1Semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 4942US2013215586A1Wiring substrateIBIDEN CO LTD·Filed 2012·Application pending·0 cites
- 5041US2006103025A1Semiconductor device including sealing ringRENESAS TECH CORP·Filed 2005·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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