Inventor · disambiguated record
Takahiro Kotani
Also filed as: KOTANI TAKAHIRO
9 granted patents·4 pending applications·9 citations·filing 2005–2024
81Inventor score
Top patents by PatentIndex Score
13 records- 0171US8697803B2Epoxy resin composition and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2012·Granted Apr 15, 2014·2 cites·7 claims
- 0268US2024283439A1Switch driving deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 0364US8008410B2Epoxy resin composition for encapsulating semiconductor and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Granted Aug 30, 2011·4 cites·14 claims
- 0463US12436038B2Semiconductor device, temperature detection system, and vehicleROHM CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·11 claims
- 0561US8519067B2Epoxy resin composition and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2012·Granted Aug 27, 2013·1 cites·6 claims
- 0661US2025069998A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 0760US8324326B2Epoxy resin composition and semiconductor deviceKOTANI TAKAHIRO·Filed 2008·Granted Dec 4, 2012·2 cites·7 claims
- 0853US8921461B2Epoxy resin composition and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2012·Granted Dec 30, 2014·0 cites·10 claims
- 0951US11923833B2Switch driving deviceROHM CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·16 claims
- 1048US9135677B2Apparatus which layout one or more images and produce output, and the method thereofCANON KK·Filed 2013·Granted Sep 15, 2015·0 cites·19 claims
- 1144US11015017B2Resin composition for encapsulating semiconductor, semiconductor device, and method for producing resin composition for encapsulating semiconductorSUMITOMO BAKELITE CO·Filed 2019·Granted May 25, 2021·0 cites·6 claims
- 1242US2006157872A1Epoxy resin composition and semiconductor deviceKOTANI TAKAHIRO·Filed 2005·Application pending·0 cites
- 1334US2013337608A1Semiconductor device, and process for manufacturing semiconductor deviceKOTANI TAKAHIRO·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →