Inventor · disambiguated record

Masayuki Horino

Also filed as: HORINO MASAYUKI

2 granted patents·8 citations·filing 2007–2008

51Inventor score

Technology areasH10W

Files withHORINO MASAYUKI1 SHINKAWA KK1

Top patents by PatentIndex Score

2 records

0172US7644852B2Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatusSHINKAWA KK·Filed 2007·Granted Jan 12, 2010·7 cites·4 claims
0247US8283593B2Wire cleaning guideHORINO MASAYUKI·Filed 2008·Granted Oct 9, 2012·1 cites·6 claims

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