Inventor · disambiguated record
Stephen Gonya
Also filed as: GONYA STEPHEN · GONYA STEPHEN G
22 granted patents·2 pending applications·507 citations·filing 1993–2019
96Inventor score
Top patents by PatentIndex Score
24 records- 0197US6410857B1Signal cross-over interconnect for a double-sided circuit card assemblyLOCKHEED CORP·Filed 2001·Granted Jun 25, 2002·129 cites·29 claims
- 0291US8772745B1X-ray obscuration film and related techniquesLOCKHEED CORP·Filed 2013·Granted Jul 8, 2014·10 cites·28 claims
- 0390US9263400B2X-ray obscuration film and related techniquesLOCKHEED CORP·Filed 2015·Granted Feb 16, 2016·7 cites·20 claims
- 0490US9258907B2Conformal 3D non-planar multi-layer circuitryGONYA STEPHEN·Filed 2012·Granted Feb 9, 2016·12 cites·14 claims
- 0590US9087617B2X-ray obscuration film and related techniquesLOCKHEED CORP·Filed 2014·Granted Jul 21, 2015·9 cites·20 claims
- 0689US7151504B1Multi-layer radomeLOCKHEED CORP·Filed 2005·Granted Dec 19, 2006·36 cites·22 claims
- 0789US5328660ALead-free, high temperature, tin based multi-component solderIBM·Filed 1993·Granted Jul 12, 1994·56 cites·1 claims
- 0886US9894760B2Conformal 3D non-planar multi-layer circuitryLOCKHEED CORP·Filed 2016·Granted Feb 13, 2018·4 cites·4 claims
- 0986US8878072B2High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachmentGONYA STEPHEN·Filed 2012·Granted Nov 4, 2014·10 cites·19 claims
- 1085US7242365B1Seam arrangement for a radomeLOCKHEED CORP·Filed 2005·Granted Jul 10, 2007·22 cites·24 claims
- 1182US5368814ALead free, tin-bismuth solder alloysIBM·Filed 1993·Granted Nov 29, 1994·69 cites·2 claims
- 1279US9515030B2X-ray obscuration film and related techniquesLOCKHEED CORP·Filed 2016·Granted Dec 6, 2016·2 cites·20 claims
- 1377US5393489AHigh temperature, lead-free, tin based solder compositionIBM·Filed 1993·Granted Feb 28, 1995·56 cites·1 claims
- 1474US5344607ALead-free, high tin, ternary solder alloy of tin, bismuth, and indiumIBM·Filed 1993·Granted Sep 6, 1994·25 cites·1 claims
- 1570US5411703ALead-free, tin, antimony, bismtuh, copper solder alloyIBM·Filed 1993·Granted May 2, 1995·41 cites·1 claims
- 1666US5414303ALead-free, high tin, ternary solder alloy of tin, bismuth, and indiumIBM·Filed 1994·Granted May 9, 1995·19 cites·4 claims
- 1763US10827608B2Conformal 3D non-planar multi-layer circuitryLOCKHEED CORP·Filed 2019·Granted Nov 3, 2020·0 cites·7 claims
- 1860US10568204B2Conformal 3D non-planar multi-layer circuitryLOCKHEED CORP·Filed 2018·Granted Feb 18, 2020·0 cites·14 claims
- 1957US10123410B2Fine line 3D non-planar conforming circuitLOCKHEED CORP·Filed 2014·Granted Nov 6, 2018·0 cites·11 claims
- 2055US9812228B2X-ray obscuration film and related techniquesLOCKHEED CORP·Filed 2016·Granted Nov 7, 2017·0 cites·19 claims
- 2153US7804179B2Plastic ball grid array ruggedizationLOCKHEED CORP·Filed 2008·Granted Sep 28, 2010·0 cites·5 claims
- 2251US10154584B2Method of producing a fine line 3D non-planar conforming circuitLOCKHEED CORP·Filed 2016·Granted Dec 11, 2018·0 cites·8 claims
- 2346US2015282317A1Edge contacts of circuit boards, and related apparatus and methodsLOCKHEED CORP·Filed 2014·Application pending·0 cites
- 2434US2006046635A1Venting memberGONYA STEPHEN G·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →